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H5MS2532JFR-L3M PDF预览

H5MS2532JFR-L3M

更新时间: 2024-11-24 19:49:19
品牌 Logo 应用领域
海力士 - HYNIX 时钟动态存储器双倍数据速率内存集成电路
页数 文件大小 规格书
63页 1536K
描述
DDR DRAM, 8MX32, 7ns, CMOS, PBGA90, 8 X 13 MM, 1 MM HEIGHT, LEAD FREE AND HALOGEN FREE, FBGA-90

H5MS2532JFR-L3M 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Obsolete零件包装代码:BGA
包装说明:VFBGA, BGA90,9X15,32针数:90
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.24风险等级:5.84
Is Samacsys:N访问模式:FOUR BANK PAGE BURST
最长访问时间:7 ns其他特性:AUTO/SELF REFRESH
最大时钟频率 (fCLK):100 MHzI/O 类型:COMMON
交错的突发长度:2,4,8JESD-30 代码:R-PBGA-B90
JESD-609代码:e1长度:13 mm
内存密度:268435456 bit内存集成电路类型:DDR DRAM
内存宽度:32功能数量:1
端口数量:1端子数量:90
字数:8388608 words字数代码:8000000
工作模式:SYNCHRONOUS最高工作温度:85 °C
最低工作温度:-30 °C组织:8MX32
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:VFBGA封装等效代码:BGA90,9X15,32
封装形状:RECTANGULAR封装形式:GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度):260电源:1.8 V
认证状态:Not Qualified刷新周期:8192
座面最大高度:1 mm自我刷新:YES
连续突发长度:2,4,8最大待机电流:0.00001 A
子类别:DRAMs最大压摆率:0.095 mA
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:20宽度:8 mm
Base Number Matches:1

H5MS2532JFR-L3M 数据手册

 浏览型号H5MS2532JFR-L3M的Datasheet PDF文件第2页浏览型号H5MS2532JFR-L3M的Datasheet PDF文件第3页浏览型号H5MS2532JFR-L3M的Datasheet PDF文件第4页浏览型号H5MS2532JFR-L3M的Datasheet PDF文件第5页浏览型号H5MS2532JFR-L3M的Datasheet PDF文件第6页浏览型号H5MS2532JFR-L3M的Datasheet PDF文件第7页 
256Mbit MOBILE DDR SDRAM based on 2M x 4Bank x32 I/O  
Specification of  
256Mb (8Mx32bit) Mobile DDR SDRAM  
Memory Cell Array  
- Organized as 4banks of 2,097,152 x32  
This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for  
use of circuits described. No patent licenses are implied.  
Rev 1.2 / Apr. 2009  
1

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