FQU6P25

更新时间： 2024-11-22 22:18:11

品牌	Logo	应用领域
飞兆/仙童 - FAIRCHILD		/
页数	文件大小	规格书
9页	512K
描述
250V P-Channel MOSFET

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数据手册

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FQU6P25 数据手册

April 2000

QFET

FQD6P25 / FQU6P25

250V P-Channel MOSFET

General Description

Features

These P-Channel enhancement mode power field effect

transistors are produced using Fairchild’s proprietary,

planar stripe, DMOS technology.

This advanced technology has been especially tailored to

minimize on-state resistance, provide superior switching

performance, and withstand high energy pulse in the

avalanche and commutation mode. These devices are well

suited for high efficiency switching DC/DC converters.

•

-4.7A, -250V, R

= 1.1Ω @V = -10 V

DS(on) GS

Low gate charge ( typical 21 nC)

Low Crss ( typical 20 pF)

Fast switching

100% avalanche tested

Improved dv/dt capability

ꢀ

G_!

ꢁ

ꢀ

I-PAK

FQU Series

D-PAK

FQD Series

ꢀ

Absolute Maximum Ratings

ꢀꢀ

T = 25°C unless otherwise noted

Symbol

Parameter

FQD6P25 / FQU6P25

Units

Drain-Source Voltage

-250

-4.7

DSS

- Continuous (T = 25°C)

Drain Current

- Continuous (T = 100°C)

-3.0

(Note 1)

Drain Current

- Pulsed

-18.8

±ꢀ30

540

Gate-Source Voltage

GSS

(Note 2)

(Note 1)

(Note 3)

Single Pulsed Avalanche Energy

Avalanche Current

-4.7

Repetitive Avalanche Energy

Peak Diode Recovery dv/dt

5.5

V/ns

dv/dt

-5.5

Power Dissipation (T = 25°C) *

2.5

Power Dissipation (T = 25°C)

- Derate above 25°C

Operating and Storage Temperature Range

0.44

-55 to +150

W/°C

°C

T , T

STG

Maximum lead temperature for soldering purposes,

300

°C

1/8ꢀꢁfrom case for 5 seconds

Thermal Characteristics

Symbol

Parameter

Typ

Max

2.27

Units

°CꢁW

Thermal Resistance, Junction-to-Case

Thermal Resistance, Junction-to-Ambient *

Thermal Resistance, Junction-to-Ambient

110

* When mounted on the minimum pad size recommended (PCB Mount)

Rev. A, April 2000

12 3 4 5 6 7...9

中文翻译

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