April 2009
UniFETTM
FDP6N60ZU / FDPF6N60ZUT
N-Channel MOSFET, FRFET
600V, 4.5A, 2Ω
Features
Description
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RDS(on) = 1.7Ω ( Typ.) @ VGS = 10V, ID = 2.25A
Low gate charge ( Typ. 14.5nC)
Low Crss ( Typ. 5pF)
These N-Channel enhancement mode power field effect
transistors are produced using Fairchild’s proprietary, planar
stripe, DMOS technology.
This advanced technology has been especially tailored to
minimize on-state resistance, provide superior switching
performance, and withstand high energy pulse in the avalanche
and commutation mode. These devices are well suited for high
efficient switched mode power supplies and active power factor
correction.
Fast switching
100% avalanche tested
Improved dv/dt capability
RoHS compliant
D
G
TO-220F
FDPF Series
TO-220
FDP Series
G D S
G
D S
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
VGSS
Parameter
FDP6N60ZU
FDPF6N60ZUT Units
Drain to Source Voltage
Gate to Source Voltage
600
V
V
±30
-Continuous (TC = 25oC)
-Continuous (TC = 100oC)
- Pulsed
4.5
2.7
18
4.5*
2.7*
18*
ID
Drain Current
A
IDM
Drain Current
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
A
mJ
A
EAS
IAR
Single Pulsed Avalanche Energy
Avalanche Current
150
4.5
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
10.5
20
mJ
V/ns
W
W/oC
oC
(TC = 25oC)
- Derate above 25oC
105
33.8
0.27
PD
Power Dissipation
0.85
TJ, TSTG
TL
Operating and Storage Temperature Range
-55 to +150
300
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
oC
*Drain current limited by maximum junction temperature
Thermal Characteristics
Symbol
RθJC
Parameter
Units
FDP6N60ZU
FDPF6N60ZUT
Thermal Resistance, Junction to Case
Thermal Resistance, Case to Sink Typ.
Thermal Resistance, Junction to Ambient
1.2
0.5
3.7
-
RθCS
RθJA
oC/W
62.5
62.5
©2009 Fairchild Semiconductor Corporation
FDP6N60ZU / FDPF6N60ZUT Rev. A
1
www.fairchildsemi.com