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FDPF6N60ZUT_12 PDF预览

FDPF6N60ZUT_12

更新时间: 2024-11-18 12:23:39
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
9页 291K
描述
N-Channel MOSFET, FRFET 600V, 4.5A, 2Ω

FDPF6N60ZUT_12 数据手册

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April 2012  
UniFETM  
FDP6N60ZU / FDPF6N60ZUT  
N-Channel MOSFET, FRFET  
600V, 4.5A, 2Ω  
Features  
Description  
RDS(on) = 1.7Ω ( Typ.) @ VGS = 10V, ID = 2.25A  
Low gate charge ( Typ. 14.5nC)  
Low Crss ( Typ. 5pF)  
These N-Channel enhancement mode power field effect  
transistors are produced using Fairchild’s proprietary, planar  
stripe, DMOS technology.  
This advanced technology has been especially tailored to  
minimize on-state resistance, provide superior switching  
performance, and withstand high energy pulse in the avalanche  
and commutation mode. These devices are well suited for high  
efficient switched mode power supplies and active power factor  
correction.  
Fast switching  
100% avalanche tested  
Improved dv/dt capability  
RoHS compliant  
D
G
TO-220F  
FDPF Series  
TO-220  
FDP Series  
G D S  
G
D S  
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*  
Symbol  
VDSS  
VGSS  
Parameter  
FDP6N60ZU  
FDPF6N60ZUT Units  
Drain to Source Voltage  
Gate to Source Voltage  
600  
V
V
±30  
-Continuous (TC = 25oC)  
-Continuous (TC = 100oC)  
- Pulsed  
4.5  
2.7  
18  
4.5*  
2.7*  
18*  
ID  
Drain Current  
A
IDM  
Drain Current  
(Note 1)  
(Note 2)  
(Note 1)  
(Note 1)  
(Note 3)  
A
mJ  
A
EAS  
IAR  
Single Pulsed Avalanche Energy  
Avalanche Current  
150  
4.5  
EAR  
dv/dt  
Repetitive Avalanche Energy  
Peak Diode Recovery dv/dt  
10.5  
20  
mJ  
V/ns  
W
W/oC  
oC  
(TC = 25oC)  
- Derate above 25oC  
105  
33.8  
0.27  
PD  
Power Dissipation  
0.85  
TJ, TSTG  
TL  
Operating and Storage Temperature Range  
-55 to +150  
300  
Maximum Lead Temperature for Soldering Purpose,  
1/8” from Case for 5 Seconds  
oC  
*Drain current limited by maximum junction temperature  
Thermal Characteristics  
Symbol  
RθJC  
Parameter  
Units  
FDP6N60ZU  
FDPF6N60ZUT  
Thermal Resistance, Junction to Case  
Thermal Resistance, Case to Sink Typ.  
Thermal Resistance, Junction to Ambient  
1.2  
0.5  
3.7  
-
RθCS  
RθJA  
oC/W  
62.5  
62.5  
©2012 Fairchild Semiconductor Corporation  
FDP6N60ZU / FDPF6N60ZUT Rev. C0  
1
www.fairchildsemi.com  

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