March 2013
FDD4N60NZ
TM
N-Channel UniFET II MOSFET
600 V, 3.4 A, 2.5
Features
Description
•
•
•
•
•
RDS(on) = 1.9 (Typ.) @ VGS = 10 V, ID = 1.7 A
Low Gate Charge (Typ. 8.3 nC)
Low Crss (Typ. 3.7 pF)
UniFETTM II MOSFET is Fairchild Semiconductor®’s high volt-
age MOSFET family based on advanced planar stripe and
DMOS technology. This advanced MOSFET family has the
smallest on-state resistance among the planar MOSFET, and
also provides superior switching performance and higher ava-
lanche energy strength. In addition, internal gate-source ESD
diode allows UniFETTM II MOSFET to withstand over 2kV HBM
surge stress. This device family is suitable for switching power
converter applications such as power factor correction (PFC), flat
panel display (FPD) TV power, ATX and electronic lamp ballasts.
100% Avalanche Tested
Improved dv/dt Capability
•
•
ESD Improved Capability
RoHS Compliant
Applications
•
•
•
LCD/LED/PDP TV
Lighting
Uninterruptible Power Supply
D
D
G
G
S
D-PAK
S
MOSFET Maximum Ratings TC = 25oC unless otherwise noted*
Symbol
VDSS
VGSS
Parameter
FDD4N60NZ
Unit
V
Drain to Source Voltage
Gate to Source Voltage
600
±25
V
- Continuous (TC = 25oC)
- Continuous (TC = 100oC)
- Pulsed
3.4
ID
Drain Current
A
2
IDM
Drain Current
(Note 1)
(Note 2)
(Note 1)
(Note 1)
(Note 3)
13.6
179.2
3.4
A
mJ
A
EAS
IAR
Single Pulsed Avalanche Energy
Avalanche Current
EAR
dv/dt
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
11.4
5
mJ
V/ns
W
W/oC
oC
(TC = 25oC)
- Derate above 25oC
114
PD
Power Dissipation
0.9
TJ, TSTG
TL
Operating and Storage Temperature Range
-55 to +150
Maximum Lead Temperature for Soldering Purpose,
1/8” from Case for 5 Seconds
300
oC
Thermal Characteristics
Symbol
Parameter
Unit
FDD4N60NZ
RJC
RJA
Thermal Resistance, Junction to Case, Max.
Thermal Resistance, Junction to Ambient, Max.
1.1
oC/W
110
1
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©2012 Fairchild Semiconductor Corporation
FDD4N60NZ Rev. C0