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FDC6401N PDF预览

FDC6401N

更新时间: 2023-09-03 20:38:03
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 327K
描述
双 N 沟道,PowerTrench® MOSFET,2.5V 指定,20V,3.0A,70mΩ

FDC6401N 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOT
包装说明:SUPERSOT-6针数:6
Reach Compliance Code:unknown风险等级:5.36
Is Samacsys:N配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (ID):3 A
最大漏源导通电阻:0.07 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:N-CHANNEL认证状态:COMMERCIAL
表面贴装:YES端子面层:MATTE TIN
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDC6401N 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Dual, N-Channel,  
POWERTRENCH), Specified  
V
R
MAX  
I MAX  
D
DSS  
DS(ON)  
20 V  
70 mW @ 4.5 V  
95 mW @ 2.5 V  
3.0 A  
2.5 V  
D2  
S1  
FDC6401N  
D1  
G2  
General Description  
S2  
G1  
This Dual NChannel MOSFET has been designed specifically  
to improve the overall efficiency of DC/DC converters using either  
synchronous or conventional switching PWM controllers. It has been  
TSOT23 6Lead  
(SUPERSOTt6)  
CASE 419BL  
optimized for low gate charge, low R  
and fast switching speed.  
DS(ON)  
MARKING DIAGRAM  
Features  
3.0 A, 20 V.  
R
R
= 70 mW @ V = 4.5 V  
GS  
DS(ON)  
= 95 mW @ V = 2.5 V  
DS(ON)  
GS  
401 MG  
Low Gate Charge (3.3 nC)  
G
High Performance Trench Technology for Extremely Low R  
High Power and Current Handling Capability  
This is a PbFree and Halide Free Device  
DS(ON)  
401  
M
G
= Specific Device Code  
= Date Code  
= PbFree Package  
Applications  
(Note: Microdot may be in either location)  
DC/DC Converter  
Battery Protection  
Power Management  
PIN ASSIGNMENT  
4
5
6
3
2
1
ABSOLUTE MAXIMUM RATINGS T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
DrainSource Voltage  
GateSource Voltage  
Value  
20  
Unit  
V
V
DSS  
GSS  
V
12  
V
I
D
Drain Current  
A
Continuous (Note 1a.)  
3.0  
12  
Pulsed  
ORDERING INFORMATION  
P
D
Power Dissipation for Single  
Operation  
W
Device  
Package  
Shipping  
3000 /  
Tape & Reel  
(Note 1a.)  
0.96  
0.9  
0.7  
TSOT236  
(SUPERSOTt6)  
(PbFree)  
FDC6401N  
(Note 1b.)  
(Note 1c.)  
T , T  
Operating and Storage Junction  
Temperature Range  
55 to  
°C  
J
STG  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
+150  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS T = 25°C unless otherwise noted  
A
Symbol  
Parameter  
Value  
Unit  
R
Thermal Resistance,  
JunctiontoAmbient (Note 1a.)  
130  
°C/W  
q
JA  
R
Thermal Resistance,  
JunctiontoCase (Note 1)  
60  
°C/W  
q
JC  
© Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
May, 2022 Rev. 3  
FDC6401N/D  

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