DATA SHEET
www.onsemi.com
MOSFET – Dual,
N & P-Channel,
POWERTRENCH)
V
R
MAX
I
MAX
D
DSS
DS(ON)
20 V
0.08 W @ 4.5 V
0.12 W @ 2.5 V
2.7 A
V
DSS
R
MAX
I MAX
D
2.5 V Specified
DS(ON)
−20 V
0.17 W @ −4.5 V
0.25 W @ −2.5 V
−1.6 A
FDC6327C
General Description
These N & P−Channel 2.5 V specified MOSFETs are produced
using onsemi’s advanced POWERTRENCH process that has been
especially tailored to minimize on−state resistance and yet maintain
low gate charge for superior switching performance.
These devices have been designed to offer exceptional power
dissipation in a very small footprint for applications where the bigger
more expensive SO−8 and TSSOP−8 packages are impractical.
D2
S1
D1
G2
S2
G1
TSOT23 6−Lead
SUPERSOTt−6
CASE 419BL
Features
• N−Channel 2.7 A, 20 V
MARKING DIAGRAM
R
R
= 0.08 W @ V = 4.5 V
GS
DS(ON)
= 0.12 W @ V = 2.5 V
DS(ON)
GS
• P−Channel −1.6 A, −20 V
327 MG
R
R
= 0.17 W @ V = −4.5 V
GS
DS(ON)
G
= 0.25 W @ V = −2.5 V
DS(ON)
GS
1
• Fast Switching Speed
327 = Specific Device Code
• Low Gate Charge
M
G
= Assembly Operation Month
= Pb−Free Package
• High Performance Trench Technology for Extremely Low R
DS(ON)
• SUPERSOTt−6 Package: Small Footprint (72% Smaller than
(Note: Microdot may be in either location)
SO−8); Low Profile (1 mm Thick)
• This is a Pb−Free Device
PINOUT
Applications
• DC/DC Converter
• Load Switch
• Motor Driving
3
2
1
4
5
6
ORDERING INFORMATION
†
Device
FDC6327C
Package
Shipping
3000 /
Tape & Reel
TSOT−23−6
(Pb−free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 1999
1
Publication Order Number:
February, 2022 − Rev. 6
FDC6327C/D