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FDB6644S PDF预览

FDB6644S

更新时间: 2024-02-21 17:35:42
品牌 Logo 应用领域
其他 - ETC 晶体晶体管开关脉冲
页数 文件大小 规格书
11页 476K
描述
TRANSISTOR | MOSFET | N-CHANNEL | 30V V(BR)DSS | 55A I(D) | TO-263AB

FDB6644S 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:D2PAK包装说明:D2PAK-3
针数:3Reach Compliance Code:not_compliant
ECCN代码:EAR99风险等级:5.88
外壳连接:DRAIN配置:SINGLE WITH BUILT-IN DIODE
最小漏源击穿电压:30 V最大漏极电流 (Abs) (ID):55 A
最大漏极电流 (ID):55 A最大漏源导通电阻:0.01 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJEDEC-95代码:TO-263AB
JESD-30 代码:R-PSSO-G2JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:2工作模式:ENHANCEMENT MODE
最高工作温度:125 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):60 W
最大脉冲漏极电流 (IDM):150 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin/Lead (Sn85Pb15)端子形式:GULL WING
端子位置:SINGLE晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

FDB6644S 数据手册

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JULY 2001  
FDP6644S/FDB6644S  
30V N-Channel PowerTrenchSyncFET™  
General Description  
Features  
This MOSFET is designed to replace a single MOSFET  
and parallel Schottky diode in synchronous DC:DC  
power supplies. This 30V MOSFET is designed to  
maximize power conversion efficiency, providing a low  
RDS(ON) and low gate charge. The FDP6644S includes  
an integrated Schottky diode using Fairchild’s  
monolithic SyncFET technology. The performance of  
the FDP6644S/FDB6644S as the low-side switch in a  
synchronous rectifier is indistinguishable from the  
performance of the FDP6644/FDB6644 in parallel with  
a Schottky diode.  
28 A, 30 V.  
RDS(ON) = 10 m@ VGS = 10 V  
DS(ON) = 12 m@ VGS = 4.5 V  
R
Includes SyncFET Schottky body diode  
Low gate charge (27nC typical)  
High performance trench technology for extremely  
low RDS(ON) and fast switching  
High power and current handling capability  
D
D
G
G
G
S
TO-263AB  
TO-220  
D
FDP Series  
FDB Series  
S
S
Absolute Maximum Ratings TA=25oC unless otherwise noted  
Symbol  
Parameter  
Ratings  
Units  
VDSS  
Drain-Source Voltage  
30  
V
VGSS  
ID  
Gate-Source Voltage  
Drain Current – Continuous  
V
A
16  
55  
150  
(Note 1)  
(Note 1)  
– Pulsed  
PD  
W
W/°C  
°C  
Total Power Dissipation @ TC = 25°C  
Derate above 25°C  
Operating and Storage Junction Temperature Range  
60  
0.48  
–65 to +125  
TJ, TSTG  
TL  
Maximum lead temperature for soldering purposes,  
°C  
275  
1/8” from case for 5 seconds  
Thermal Characteristics  
RθJC  
RθJA  
Thermal Resistance, Junction-to-Case  
Thermal Resistance, Junction-to-Ambient  
2.1  
62.5  
°C/W  
°C/W  
Package Marking and Ordering Information  
Device Marking  
FDB6644S  
Device  
Reel Size  
13’’  
Tape width  
24mm  
Quantity  
800 units  
FDB6644S  
FDP6644S  
FDP6644S  
Tube  
n/a  
45  
FDP6644S/FDB6644S Rev D(W)  
2001 Fairchild Semiconductor Corporation  

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