CY62126ESL MoBL®
1-Mbit (64K x 16) Static RAM
consumption when addresses are not toggling. Placing the
device into standby mode reduces power consumption by more
than 99 percent when deselected (CE HIGH). The input and
output pins (IO0 through IO15) are placed in a high impedance
state when the device is deselected (CE HIGH), the outputs are
disabled (OE HIGH), both Byte High Enable and Byte Low
Enable are disabled (BHE, BLE HIGH) or during a write
operation (CE LOW and WE LOW).
Features
■ Very high speed: 45 ns
■ Wide voltage range: 2.2V–3.6V and 4.5V–5.5V
■ Ultra low standby power
❐ Typical standby current: 1 μA
❐ Maximum standby current: 4 μA
To write to the device, take Chip Enable (CE) and Write Enable
(WE) inputs LOW. If Byte Low Enable (BLE) is LOW, then data
from IO pins (IO0 through IO7) is written into the location
specified on the address pins (A0 through A15). If Byte High
■ Ultra low active power
❐ Typical active current: 1.3 mA at f = 1 MHz
■ Easy memory expansion with CE, and OE features
■ Automatic power down when deselected
■ CMOS for optimum speed and power
Enable (BHE) is LOW, then data from IO pins (IO8 through IO15
)
is written into the location specified on the address pins (A0
through A15).
To read from the device, take Chip Enable (CE) and Output
Enable (OE) LOW while forcing the Write Enable (WE) HIGH. If
Byte Low Enable (BLE) is LOW, then data from the memory
location specified by the address pins appear on IO0 to IO7. If
Byte High Enable (BHE) is LOW, then data from memory
appears on IO8 to IO15. See the Truth Table on page 10 for a
complete description of read and write modes.
■ Available in Pb-free 44-Pin TSOP II package
Functional Description
The CY62126ESL is a high performance CMOS static RAM
organized as 64K words by 16 bits. This device features
advanced circuit design to provide ultra low active current. This
is ideal for providing More Battery Life™ (MoBL®) in portable
applications such as cellular telephones. The device also has an
automatic power down feature that significantly reduces power
For best practice recommendations, refer to the Cypress
application note AN1064, SRAM System Guidelines.
Logic Block Diagram
DATA IN DRIVERS
A10
A9
A8
A7
A6
A5
A4
A3
64K x 16
IO0–IO7
RAM Array
IO8–IO15
A2
A1
A0
COLUMN DECODER
BHE
WE
CE
OE
BLE
Cypress Semiconductor Corporation
Document #: 001-45076 Rev. *A
•
198 Champion Court
•
San Jose, CA 95134-1709
•
408-943-2600
Revised June 15, 2009
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