Datasheet > CUS03(TE85L)

CUS03(TE85L)

更新时间： 2024-09-14 19:57:39

品牌	Logo	应用领域
东芝 - TOSHIBA		/
页数	文件大小	规格书
5页	181K
描述
Diode Schottky 40V 0.7A 2-Pin US-FLAT T/R

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中文翻译

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技术参数
数据手册

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CUS03(TE85L) 技术参数

是否Rohs认证：	不符合	生命周期：	Contact Manufacturer
Reach Compliance Code：	unknown	风险等级：	5.79
Base Number Matches：	1

CUS03(TE85L) 数据手册

CUS03

TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type

CUS03

Switching Mode Power Supply Applications

Unit: mm

Portable Equipment Battery Application

•

Forward voltage: V = 0.52 V@I = 0.7 A

FM F

Average forward current: I

= 0.7A

F (AV)

Repetitive peak reverse voltage: V

= 40 V

RRM

Suitable for compact assembly due to small surface-mount package

“US−FLAT^TM” (Toshiba package name)

Maximum Ratings

(Ta = 25°C)

Characteristics

Symbol

Rating

Unit

Repetitive peak reverse voltage

RRM

0.7

Average forward current

F (AV)

(Note 1)

Peak one cycle surge forward current

Junction temperature

20 (50 Hz)

−40 to 150

FSM

JEDEC

JEITA

―

°C

Storage temperature range

stg

TOSHIBA

3-2B1A

Note 1: Ta = 53°C: Device mounted on a glass-epoxy board

Board size: 50 mm × 50 mm,

Weight: 0.004 g (typ.)

Land size: 6 mm × 6 mm

Rectangular waveform (α = 180°), V = 20 V

Electrical Characteristics (Ta = 25°C)

Characteristics

Symbol

Test Condition

Min

Typ.

Max

Unit

= 0.1 A

= 0.7 A

―

0.37

0.48

0.4

―

0.52

―

FM (1)

FM (2)

Peak forward voltage

= 5 V

RRM (1)

RRM (2)

RRM

Repetitive peak reverse current

Junction capacitance

µA

= 40 V

3.0

100

―

= 10 V, f = 1.0 MHz

Device mounted on a ceramic board

(board size: 50 mm × 50 mm)

(soldering land: 2 mm × 2 mm)

(board thickness: 0.64 t)

―

Thermal resistance

(junction to ambient)

°C/W

th (j-a)

Device mounted on a glass-epoxy board

(board size: 50 mm × 50 mm)

(soldering land: 6 mm × 6 mm)

(board thickness: 1.6 t)

―

150

Thermal resistance (junction to lead)

Junction to lead of cathode side

th (j-ℓ)

2004-09-07

12 3 4 5

中文翻译

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