CUS03
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type
CUS03
Switching Mode Power Supply Applications
Unit: mm
Portable Equipment Battery Application
•
•
•
•
Forward voltage: V
= 0.52 V@I = 0.7 A
FM F
Average forward current: I
= 0.7A
F (AV)
Repetitive peak reverse voltage: V
= 40 V
RRM
Suitable for compact assembly due to small surface-mount package
“US−FLATTM” (Toshiba package name)
Absolute Maximum Ratings (Ta = 25°C)
Characteristics
Repetitive peak reverse voltage
Average forward current
Symbol
Rating
Unit
V
V
40
RRM
0.7
(Note 1)
I
A
F (AV)
Peak one cycle surge forward current
Junction temperature
I
20 (50 Hz)
−40 to 150
−40 to 150
A
FSM
T
j
°C
°C
JEDEC
JEITA
―
Storage temperature range
T
stg
Note 1: Ta = 53°C: Device mounted on a glass-epoxy board
Board size: 50 mm × 50 mm,
TOSHIBA
3-2B1A
Land size: 6 mm × 6 mm
Rectangular waveform (α = 180°), V = 20 V
Weight: 0.004 g (typ.)
R
Note 2: Using continuously under heavy loads (e.g. the application of
high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to
decrease in the reliability significantly even if the operating conditions (i.e. operating
temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
V
V
V
I
I
= 0.1 A
= 0.7 A
―
―
―
―
―
0.37
0.48
0.4
―
0.52
―
FM (1)
FM (2)
FM
FM
Peak forward voltage
I
V
V
V
= 5 V
RRM (1)
RRM (2)
RRM
RRM
Repetitive peak reverse current
Junction capacitance
μA
I
= 40 V
3.0
100
―
C
= 10 V, f = 1.0 MHz
R
45
pF
j
Device mounted on a ceramic board
(board size: 50 mm × 50 mm)
(soldering land: 2 mm × 2 mm)
(board thickness: 0.64 t)
―
―
75
Thermal resistance
(junction to ambient)
R
°C/W
th (j-a)
Device mounted on a glass-epoxy board
(board size: 50 mm × 50 mm)
(soldering land: 6 mm × 6 mm)
(board thickness: 1.6 t)
―
―
―
―
150
30
Thermal resistance (junction to lead)
R
Junction to lead of cathode side
°C/W
th (j-ℓ)
1
2006-11-13