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CUS04(TE85L,Q)

更新时间: 2024-09-14 14:50:11
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 169K
描述
DIODE SCHOTTKY 0.7A 60V US-FLAT

CUS04(TE85L,Q) 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:unknown风险等级:5.69
Base Number Matches:1

CUS04(TE85L,Q) 数据手册

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CUS04  
TOSHIBA Schottky Barrier Rectifier Schottky Barrier Type  
CUS04  
Switching Mode Power Supply Applications  
Unit: mm  
Portable Equipment Battery Applications  
+ 0.2  
0.1  
1.25  
+ 0.05  
0.13  
0.88 ± 0.1  
0.03  
Forward voltage: V  
= 0.58 V@I = 0.7 A  
FM F  
Average forward current: I  
= 0.7 A  
F (AV)  
Repetitive peak reverse voltage: V  
= 60 V  
RRM  
Suitable for high-density board assembly due to the use of a small  
surface-mount package, USFLATTM  
Absolute Maximum Ratings (Ta = 25°C)  
0.6 ± 0.1  
Characteristics  
Symbol  
Rating  
Unit  
V
0.88 ± 0.1  
Repetitive peak reverse voltage  
V
60  
RRM  
0.6 ± 0.1  
0.7  
(Note 1)  
Average forward current  
I
A
A
F (AV)  
Peak one cycle surge forward current  
(Non-repetitive)  
I
20 (50 Hz)  
FSM  
0.78 ± 0.1  
ANODE  
Junction temperature  
T
j
40 to 150  
40 to 150  
°C  
°C  
CATHODE  
Storage temperature range  
T
stg  
0.6 ± 0.1  
JEDEC  
Note 1: Ta = 27°C: Device mounted on a glass-epoxy board  
Board size: 50 mm × 50 mm,  
JEITA  
Land size: 6 mm × 6 mm  
TOSHIBA  
3-2B1A  
Rectangular waveform (α = 180°), V = 30 V  
R
Note 2: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
Weight: 0.004 g (typ.)  
temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating  
conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Electrical Characteristics (Ta = 25°C)  
Characteristics  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
V
I
I
= 0.1 A  
= 0.7 A  
0.40  
0.55  
0.3  
0.58  
FM (1)  
FM (2)  
FM  
FM  
Peak forward voltage  
I
V
V
V
= 5 V  
RRM (1)  
RRM (2)  
RRM  
RRM  
Repetitive peak reverse current  
Junction capacitance  
μA  
I
= 60 V  
3.0  
100  
C
= 10 V, f = 1.0 MHz  
R
38  
pF  
j
Device mounted on a ceramic board  
(board size: 50 mm × 50 mm)  
(soldering land: 2 mm × 2 mm)  
(board thickness: 0.64 mm)  
75  
Thermal resistance  
(junction to ambient)  
R
°C/W  
th (j-a)  
Device mounted on a glass-epoxy board  
(board size: 50 mm × 50 mm)  
(soldering land: 6 mm × 6 mm)  
(board thickness: 1.6 mm)  
150  
30  
Thermal resistance (junction to lead)  
R
Junction to lead of cathode side  
°C/W  
th (j-)  
1
2008-05-13  

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