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CS3N30B23H PDF预览

CS3N30B23H

更新时间: 2024-10-29 17:00:47
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10页 246K
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SOT-223

CS3N30B23H 数据手册

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CS3N30 B23H  
R
The name and content of poisonous and harmful material in products  
Hazardous Substance  
Parts Name  
Pb  
Hg  
Cd  
Cr(VI)  
PBB  
PBDE  
DIBP  
DEHP  
DBP  
BBP  
Limit  
0.1% 0.1%  
0.1% 0.1% 0.1% 0.1% 0.1% 0.1% 0.1%  
0.01%  
Lead Frame  
Molding  
Chip  
×
Wire Bonding  
Solder  
○:means the hazardous material is under the criterion of SJ/T11363-2006.  
×:means the hazardous material exceeds the criterion of SJ/T11363-2006.  
Note  
The plumbum element of solder exist in products presently, but within the allowed range of  
Eurogroups RoHS.  
Warnings  
1. Exceeding the maximum ratings of the device in performance may cause damage to the device, even the  
permanent failure, which may affect the dependability of the machine. It is suggested to be used under 80  
percent of the maximum ratings of the device.  
2. When installing the heatsink, please pay attention to the torsional moment and the smoothness of the heatsink.  
3. VDMOSFETs is the device which is sensitive to the static electricity, it is necessary to protect the device from  
being damaged by the static electricity when using it.  
4. This publication is made by Huajing Microelectronics and subject to regular change without notice.  
Communication  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.  
AddNo.14 Liangxi RD. Wuxi, Jiangsu, China Mail:214061  
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http://www. crhj.com.cn  
UTH  
Tel: +86 0510-85807228 Fax: +86- 0510-85800864  
Marketing Part:  
Post214061  
Tel+86 0510-81805277/81805336  
Fax: +86 0510-85800360/85803016  
E-mailsales@hj.crmicro.com  
Application and ServicePost214061 Tel / Fax+86- 0510-81805243/81805110  
WUXI CHINA RESOURCES HUAJING MICROELECTRONICS CO., LTD.  
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