CGHV14800
Absolute Maximum Ratings (not simultaneous)
Parameter
Symbol
VDSS
VGS
Rating
150
Units
Conditions
Drain-Source Voltage
V
25˚C
Gate-to-Source Voltage
Storage Temperature
-10, +2
-65, +150
225
TSTG
TJ
ºC
Operating Junction Temperature
Maximum Forward Gate Current
Maximum Drain Current1
Maximum Duty Cycle
IGMAX
IDMAX
D
132
mA
A
25ºC
24
5
%
Soldering Temperature2
TS
245
ºC
Screw Torque
τ
40
in-oz
ºC/W
ºC
Pulsed Thermal Resistance, Junction to Case3
Case Operating Temperature4
RθJC
TC
0.16
PDISS = 664 W, 100µsec, 5%, 85ºC
PDISS = 664 W, 100µsec, 5%
-40, +100
Notes:
3 Measured for the CGHV14800F-AMP
1 Current limit for long term, reliable operation
2 Refer to the Application Note on soldering
4 See also, the Power Dissipation De-rating Curve on Page 7
Electrical Characteristics (TC = 25ºC)
Characteristics
Symbol Min.
Typ.
Max. Units Conditions
DC Characteristics1
Gate Threshold Voltage
Gate Quiescent Voltage
Saturated Drain Current2
Drain-Source Breakdown Voltage
VGS(th)
VGS(Q)
IDS
-3.8
-3.0
-2.7
123.5
—
-2.3
—
VDS = 10 V, ID = 132.8 mA
VDS = 50 V, ID = 800 mA
VDS = 6.0 V, VGS = 2.0 V
VGS = -8 V, ID = 132.8 mA
VDC
—
—
86.3
125
A
—
VBR
VDC
RF Characteristics3 (TC = 25ºC, F0 = 1.3 GHz unless otherwise noted)
—
Output Power at ƒ = 1.2 GHz
Output Power at ƒ = 1.23 GHz
Output Power at ƒ = 1.4 GHz
Drain Efficiency at ƒ = 1.2 GHz
Drain Efficiency at ƒ = 1.23 GHz
Drain Efficiency at ƒ = 1.4 GHz
Pulsed Amplitude Droop
804
795
750
62
977
933
912
—
—
—
—
—
—
POUT
W
%
VDD = 50 V, IDQ = 800 mA, PIN = 44.5 dBm
VDD = 50 V, IDQ = 800 mA
71
η
63
57
67
—
D
-0.3
dB
No damage at all phase angles,
VDD = 50 V, IDQ = 800 mA, PIN = 44.5 dBm Pulsed
—
—
Y
Output Mismatch Stress
VSWR
9:1
Dynamic Characteristics
Input Capacitance
—
—
—
—
—
—
CGS
CDS
CGD
326
643
3.9
Output Capacitance
pF
VDS = 50 V, VGS = -8 V, ƒ = 1 MHz
Feedback Capacitance
Notes:
1 Measured on wafer prior to packaging
2 Scaled from PCM data
3 Measured in CGHV14800F-AMP. Pulsed Width = 100µs, Duty Cycle = 5%.
2
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Rev. 2.5, 2022-12-2
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