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BSS84 PDF预览

BSS84

更新时间: 2024-11-18 22:39:39
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管场效应晶体管
页数 文件大小 规格书
2页 51K
描述
P-CHANNEL ENHANCEMENT MODE FIELD EFFECT TRANSISTOR

BSS84 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Obsolete零件包装代码:SOT-23
包装说明:SOT-23, 3 PIN针数:3
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8541.21.00.95风险等级:5
配置:SINGLE最小漏源击穿电压:50 V
最大漏极电流 (Abs) (ID):0.13 A最大漏极电流 (ID):0.13 A
最大漏源导通电阻:10 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PDSO-G3JESD-609代码:e0
湿度敏感等级:1元件数量:1
端子数量:3工作模式:ENHANCEMENT MODE
最高工作温度:150 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):235极性/信道类型:P-CHANNEL
最大功率耗散 (Abs):0.25 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子面层:Tin/Lead (Sn/Pb)端子形式:GULL WING
端子位置:DUAL处于峰值回流温度下的最长时间:10
晶体管元件材料:SILICONBase Number Matches:1

BSS84 数据手册

 浏览型号BSS84的Datasheet PDF文件第2页 
BSS84  
P-CHANNEL ENHANCEMENT MODE FIELD EFFECT  
TRANSISTOR  
Features  
·
·
·
·
·
Low On-Resistance  
SOT-23  
A
Low Gate Threshold Voltage  
Low Input Capacitance  
Fast Switching Speed  
Dim  
A
Min  
0.37  
1.20  
2.30  
0.89  
0.45  
1.78  
2.80  
0.013  
0.903  
0.45  
0.085  
0°  
Max  
0.51  
1.40  
2.50  
1.03  
0.60  
2.05  
3.00  
0.10  
1.10  
0.61  
0.180  
8°  
D
B
C
B
Low Input/Output Leakage  
TOP VIEW  
G
S
C
D
G
E
D
Mechanical Data  
H
E
·
·
·
·
Case: SOT-23, Molded Plastic  
Case material - UL Flammability Rating 94V-0  
Moisture sensitivity: Level 1 per J-STD-020A  
Terminals: Solderable per MIL-STD-202,  
Method 208  
Terminal Connections: See Diagram  
Marking (See Page 2): K84  
Ordering & Date Code Information: See Page 2  
Weight: 0.008 grams (approx.)  
G
H
K
M
J
L
Drain  
J
K
L
·
·
·
·
Gate  
M
a
Source  
All Dimensions in mm  
@ TA = 25°C unless otherwise specified  
Maximum Ratings  
Characteristic  
Symbol  
VDSS  
VDGR  
VGSS  
ID  
BSS84  
-50  
Units  
V
Drain-Source Voltage  
-50  
V
Drain-Gate Voltage RGS £ 20KW  
Gate-Source Voltage  
Continuous  
Continuous  
±20  
V
mA  
mW  
°C/W  
°C  
Drain Current (Note 1)  
-130  
Pd  
Total Power Dissipation (Note 1)  
Thermal Resistance, Junction to Ambient  
Operating and Storage Temperature Range  
300  
RqJA  
417  
Tj, TSTG  
-55 to +150  
@ TA = 25°C unless otherwise specified  
Electrical Characteristics  
Characteristic  
OFF CHARACTERISTICS (Note 2)  
Drain-Source Breakdown Voltage  
Symbol  
BVDSS  
IDSS  
Min  
Typ  
Max Unit  
Test Condition  
VGS = 0V, ID = -250µA  
-50  
¾
¾
V
-15  
-60  
VDS = -50V, VGS = 0V, TJ = 25°C  
VDS = -50V, VGS = 0V, TJ = 125°C  
DS = -25V, VGS = 0V, TJ = 25°C  
µA  
µA  
¾
¾
¾
¾
¾
¾
Zero Gate Voltage Drain Current  
V
nA  
-100  
IGSS  
Gate-Body Leakage  
VGS = ±20V, VDS = 0V  
¾
¾
±10  
nA  
ON CHARACTERISTICS (Note 2)  
Gate Threshold Voltage  
VDS = VGS, ID = -1mA  
VGS = -5V, ID = 0.100A  
VDS = -25V, ID = 0.1A  
VGS(th)  
RDS (ON)  
gFS  
-0.8  
¾
¾
¾
¾
-2.0  
10  
V
W
S
Static Drain-Source On-Resistance  
Forward Transconductance  
DYNAMIC CHARACTERISTICS  
Input Capacitance  
.05  
¾
Ciss  
Coss  
Crss  
¾
¾
¾
¾
¾
¾
45  
25  
12  
pF  
pF  
pF  
VDS = -25V, VGS = 0V  
f = 1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
SWITCHING CHARACTERISTICS  
Turn-On Delay Time  
tD(ON)  
¾
¾
10  
18  
¾
¾
ns  
ns  
VDD = -30V, ID = -0.27A,  
RGEN = 50W, VGS = -10V  
tD(OFF)  
Turn-Off Delay Time  
Note: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout  
document AP02001, which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
2. Short duration test pulse used to minimize self-heating effect.  
DS30149 Rev. 5 - 2  
1 of 2  
BSS84  
www.diodes.com  

BSS84 替代型号

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