BSS8402DW
COMPLEMENTARY PAIR ENHANCEMENT MODE FIELD EFFECT TRANSISTOR
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Features
Mechanical Data
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Low On-Resistance
Low Gate Threshold Voltage
Low Input Capacitance
Fast Switching Speed
Low Input/Output Leakage
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Case: SOT-363
Case Material: Molded Plastic. “Green” Molding Compound.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020D
Terminals: Solderable per MIL-STD-202, Method 208
Lead Free Plating (Matte Tin Finish annealed over Alloy 42
leadframe).
Terminal Connections: See Diagram
Marking Information: See Page 5
Ordering Information: See Page 5
Weight: 0.008 grams (approximate)
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Complementary Pair
Lead Free/RoHS Compliant (Note 2)
"Green" Device (Note 3 and 4)
Qualified to AEC-Q101 Standards for High Reliability
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SOT-363
D1
G2
S2
Q1
Q2
S1
G1
D2
TOP VIEW
TOP VIEW
Internal Schematic
Maximum Ratings – Total Device @TA = 25°C unless otherwise specified
Characteristic
Power Dissipation (Note 1)
Symbol
Value
200
Units
mW
PD
Thermal Resistance, Junction to Ambient
Operating and Storage Temperature Range
625
°C/W
°C
Rθ
JA
-55 to +150
TJ, TSTG
Maximum Ratings N-CHANNEL – Q1, 2N7002 Section @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
Value
60
Units
Drain-Source Voltage
V
V
60
Drain-Gate Voltage RGS ≤ 1.0MΩ
VDGR
Gate-Source Voltage
Continuous
Pulsed
±20
±40
V
VGSS
Drain Current (Note 1)
Continuous
Continuous @ 100°C
Pulsed
115
73
800
mA
ID
Maximum Ratings P-CHANNEL – Q2, BSS84 Section @TA = 25°C unless otherwise specified
Characteristic
Symbol
VDSS
VDGR
VGSS
ID
Value
-50
Units
V
Drain-Source Voltage
-50
V
Drain-Gate Voltage RGS ≤ 20KΩ
Gate-Source Voltage
Continuous
Continuous
V
±20
-130
Drain Current (Note 1)
mA
Notes:
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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www.diodes.com
June 2008
© Diodes Incorporated
BSS8402DW
Document number: DS30380 Rev. 12 - 2