Datasheet > BSS8402DW

BSS8402DW

更新时间： 2024-11-20 14:53:31

品牌	Logo	应用领域
美微科 - MCC		/
页数	文件大小	规格书
6页	970K
描述
Tape: 3K/Reel, 120K/Ctn.;

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数据手册

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BSS8402DW 数据手册

BSS8402DW

Features

•

High Density Cell Design for Ultra Low R_DS(on)

Rugged and Reliable

Epoxy Meets UL 94 V-0 Flammability Rating

Dual

N&P-Channel

MOSFET

Moisture Sensitivity Level 1

Halogen Free. “Green” Device ^{(Note 1)}

Lead Free Finish/RoHS Compliant ("P" Suffix Designates RoHS

Compliant. See Ordering Information)

Maximum Ratings

•

Operating Junction Temperature Range : -55°C to +150°C

Storage Temperature Range: -55°C to +150°C

SOT-363

•

Thermal Resistance: 625°C/W Junction to Ambient

Parameter

Rating

Symbol

Unit

P_D

200

Total Power Dissipation

N-Channel MOSFET

Drain-Source Voltage

Gate-Source Voltage

Continuous Drain Current

P-Channel MOSFET

Drain-Source Voltage

Gate-Source Voltage

Continuous Drain Current

V_DS

V_GS

I_D

±20

0.115

V_DS

V_GS

I_D

-50

±20

DIMENSIONS

INCHES

DIM

NOTE

-0.13

-0.52

MIN MAX MIN MAX

0.006 0.014 0.15 0.35

0.045 0.053 1.15 1.35

0.079 0.096 2.00 2.45

Pulsed Drain Current^{(Note 3)}

I_DM

Note: 1. Halogen free "Green” products are defined as those which contain <900ppm bromine,

0.026

0.65

<900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

TYP.

0.047 0.055 1.20 1.40

0.071 0.087 1.80 2.20

----- 0.004 ----- 0.10

0.031 0.043 0.80 1.10

0.010 0.018 0.26 0.46

0.003 0.006 0.08 0.15

Internal Structure and Marking Code

Suggested Solder Pad Layout

842

Rev.3-5-07202022

1/6

MCCSEMI.COM

12 3 4 5 6

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