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BSP52T1/D PDF预览

BSP52T1/D

更新时间： 2024-11-28 23:35:47
品牌 Logo 应用领域
其他 - ETC 晶体晶体管达林顿晶体管
页数 文件大小 规格书
8页 55K
描述
NPN Small-Signal Darlington Transistor

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中文翻译

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BSP52T1/D 数据手册

 浏览型号BSP52T1/D的Datasheet PDF文件第2页浏览型号BSP52T1/D的Datasheet PDF文件第3页浏览型号BSP52T1/D的Datasheet PDF文件第4页浏览型号BSP52T1/D的Datasheet PDF文件第5页浏览型号BSP52T1/D的Datasheet PDF文件第6页浏览型号BSP52T1/D的Datasheet PDF文件第7页 
BSP52T1  
Preferred Device  
NPN Small-Signal  
Darlington Transistor  
This NPN small signal darlington transistor is designed for use in  
switching applications, such as print hammer, relay, solenoid and lamp  
drivers. The device is housed in the SOT-223 package, which is  
designed for medium power surface mount applications.  
http://onsemi.com  
• The SOT-223 Package can be soldered using wave or reflow. The  
formed leads absorb thermal stress during soldering, eliminating the  
possibility of damage to the die  
MEDIUM POWER  
NPN SILICON  
• Available in 12 mm Tape and Reel  
Use BSP52T1 to order the 7 inch/1000 unit reel  
• PNP Complement is BSP62T1  
SURFACE MOUNT  
DARLINGTON TRANSISTOR  
COLLECTOR 2,4  
BASE  
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
C
Rating  
Collector-Emitter Voltage  
Collector-Base Voltage  
Emitter-Base Voltage  
Collector Current  
Symbol  
Max  
80  
Unit  
Vdc  
V
CES  
CBO  
EBO  
EMITTER 3  
V
V
90  
Vdc  
5.0  
1.0  
0.8  
Vdc  
4
I
C
Adc  
Total Power Dissipation  
P
Watts  
1
2
3
D
D
@ T = 25°C (Note 1.)  
A
Derate above 25°C  
6.4  
mW/°C  
SOT–223  
CASE 318E  
STYLE 1  
Total Power Dissipation  
P
1.25  
Watts  
@ T = 25°C (Note 2.)  
Derate above 25°C  
A
10  
mW/°C  
°C  
Operating and Storage  
Temperature Range  
T , T  
–65 to 150  
J
stg  
DEVICE MARKING  
THERMAL CHARACTERISTICS  
Characteristic  
Symbol  
Value  
Unit  
LWW  
AS3  
Thermal Resistance –  
Junction-to-Ambient (Note 1.)  
R
156  
°C/W  
θ
JA  
JA  
L
Thermal Resistance –  
Junction-to-Ambient (Note 2.)  
R
100  
°C/W  
θ
L
WW  
AS3  
= Assembly Location  
= Date Code  
= Specific Device Code  
Maximum Temperature for  
Soldering Purposes  
Time in Solder Bath  
T
260  
10  
°C  
Sec  
1. Device mounted on a FR-4 glass epoxy printed circuit board using minimum  
recommended footprint.  
2. Device mounted on a FR-4 glass epoxy printed circuit board using 1 cm pad.  
ORDERING INFORMATION  
2
Device  
BSP52T1  
Package  
Shipping  
1000/Tape & Reel  
SOT–223  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2001  
1
Publication Order Number:  
January, 2001 – Rev. 2  
BSP52T1/D  
12345678

中文翻译

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