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BGA7H1N6E6327XTSA1 PDF预览

BGA7H1N6E6327XTSA1

更新时间: 2024-11-22 01:22:07
品牌 Logo 应用领域
英飞凌 - INFINEON LTE
页数 文件大小 规格书
2页 220K
描述
Infineon’s New LTE Low Noise Amplifiers Almost Double Smartphone Data Rates

BGA7H1N6E6327XTSA1 数据手册

 浏览型号BGA7H1N6E6327XTSA1的Datasheet PDF文件第2页 
Product Brief  
Infineon’s New LTE Low Noise Amplifiers  
Almost Double Smartphone Data Rates  
Improving the user experience by improving smartphone data rates by up to 96% is  
the boast of Infineon for its LTE LNA (low noise amplifiers) and quad LNA banks.  
The BGA7x1N6 and BGM7xxxx4L12 families provide a low noise figure, the exact gain  
and high linearity needed to help smartphone designers overcome the challenges  
of LTE or 4G which allows for data rates up to 300Mbit/s – compared to 56Mbit/s in  
the latest UMTS (3G) release. However, the increasing complexity of the RF front end  
results in more RF components (e.g. switches, diplexers and dividers) and leads to  
increasing losses over the whole system and deterioration of the signal-to-noise ratio  
(SNR). The distance between antenna and the RF transceiver leads to additional line  
losses that also negatively affect SNR and therefore the data rate.  
Key Features  
„
High linearity  
„
Best-in-class noise figure  
„
Low current consumption  
„
Supply voltage: 1.5V to 3.3V  
„
Ultra small  
– Single LNAs:  
TSNP-6-2 leadless package  
(footprint: 1.1 x 0.7mm2)  
– Quad LNA banks:  
The LNAs and LNA banks are based on the company’s Silicon Germanium Carbon  
(SiGe:C) chip technology and include built-in ESD protection of 2kV HBM.  
TSLP-12-4 leadless package  
(footprint: 1.1 x 1.9mm2)  
„
B7HF Silicon Germanium Carbon  
They are located in the diversity and main antenna path of the phone and push smart-  
phone data rates’ limits 96% higher than in solutions without LNAs. High linearity  
assures optimal signal reception even in conditions of poorly isolated antenna and  
long line losses between antenna and transceiver. The typical sensitivity improvement  
of 3.4dB compared to systems without LNAs is achieved in devices with a package size  
70% smaller (1.1 x 0.7mm2) than previously available LNAs and 61% smaller  
(1.9 x 1.1mm2) than previously available LNA banks.  
(SiGe:C) technology  
„
RF output internally matched  
to 50Ω  
„
Low external component count  
„
2kV HBM ESD protection  
„
Pb-free (RoHS compliant) package  
The products are also self-shielded to prevent parasitic interference and require only  
one external component per LNA.  
Applications  
„
There are three LTE LNAs and seven quad LNA bank families to address the required  
band configurations for different world regions, each letter in the series denotes a  
different frequency band: L for the low, 0.7GHz to 1GHz band; M for mid, 1.7GHz to  
2.2GHz band; and H for high, 2.3GHz to 2.7GHz band.  
Smartphones  
„
Tablets  
„
Datacards  
„
M2M communication  
They are shipped in RoHS-compliant TSNP-6-2 or TSLP 12-4 plastic packages.  
www.infineon.com/rfmmic  

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