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AUIRLS3114Z PDF预览

AUIRLS3114Z

更新时间: 2024-11-24 21:15:15
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
11页 644K
描述
Power Field-Effect Transistor, N-Channel, Metal-oxide Semiconductor FET

AUIRLS3114Z 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:16 weeks风险等级:5.71
配置:Single最大漏极电流 (Abs) (ID):56 A
FET 技术:METAL-OXIDE SEMICONDUCTOR最高工作温度:175 °C
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):143 W
子类别:FET General Purpose Power表面贴装:YES
Base Number Matches:1

AUIRLS3114Z 数据手册

 浏览型号AUIRLS3114Z的Datasheet PDF文件第2页浏览型号AUIRLS3114Z的Datasheet PDF文件第3页浏览型号AUIRLS3114Z的Datasheet PDF文件第4页浏览型号AUIRLS3114Z的Datasheet PDF文件第5页浏览型号AUIRLS3114Z的Datasheet PDF文件第6页浏览型号AUIRLS3114Z的Datasheet PDF文件第7页 
AUTOMOTIVE GRADE  
AUIRLS3114Z  
HEXFET® Power MOSFET  
Features  
Advanced Process Technology  
Ultra Low On-Resistance  
Logic Level Gate Drive  
Enhanced dv/dt and di/dt capability  
175°C Operating Temperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free, RoHS Compliant  
Automotive Qualified *  
VDSS  
40V  
3.8m  
4.9m  
122A  
56A  
RDS(on) typ.  
max.  
ID (Silicon Limited)  
ID (Package Limited)  
D
Description  
S
Specifically designed for Automotive applications, this HEXFET®  
Power MOSFET utilizes the latest processing techniques to achieve  
extremely low on-resistance per silicon area. Additional features of  
this design are a 175°C junction operating temperature, fast  
switching speed and improved repetitive avalanche rating . These  
features combine to make this design an extremely efficient and  
reliable device for use in Automotive applications and a wide variety  
of other applications.  
G
G
Gate  
D
Drain  
S
Source  
Standard Pack  
Form  
Tube  
Base part number  
Package Type  
Orderable Part Number  
Quantity  
50  
AUIRLS3114Z  
AUIRLS3114ZTRL  
AUIRLS3114Z  
D2-Pak  
Tape and Reel Left  
800  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal resistance  
and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is 25°C, unless  
otherwise specified.  
Symbol  
Parameter  
Max.  
Units  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
122  
ID @ TC = 100°C  
ID @ TC = 25°C  
Continuous Drain Current, VGS @ 10V (Silicon Limited)  
Continuous Drain Current, VGS @ 10V (Wirebond Limited)  
86  
A
56  
IDM  
Pulsed Drain Current   
Maximum Power Dissipation  
Linear Derating Factor  
488  
143  
0.95  
PD @TC = 25°C  
W
W/°C  
V
VGS  
EAS  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally Limited)   
± 16  
168  
mJ  
EAS (Tested)  
IAR  
Single Pulse Avalanche Energy (Tested)  
Avalanche Current   
518  
See Fig.15,16, 12a, 12b  
A
EAR  
Repetitive Avalanche Energy   
Peak Diode Recovery   
mJ  
dv/dt  
TJ  
2.3  
V/ns  
Operating Junction and  
-55 to + 175  
TSTG  
Storage Temperature Range  
°C  
Soldering Temperature, for 10 seconds (1.6mm from case)  
300  
Thermal Resistance  
Symbol  
Parameter  
Typ.  
Max.  
Units  
Junction-to-Case   
–––  
1.05  
RJC  
RJA  
°C/W  
Junction-to-Ambient (PCB Mount)   
–––  
40  
HEXFET® is a registered trademark of Infineon.  
*Qualification standards can be found at www.infineon.com  
1
2015-11-6  

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