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AUIRLS4030TRR PDF预览

AUIRLS4030TRR

更新时间: 2024-11-24 12:59:47
品牌 Logo 应用领域
英飞凌 - INFINEON 晶体晶体管开关脉冲局域网
页数 文件大小 规格书
13页 274K
描述
Power Field-Effect Transistor, 180A I(D), 100V, 0.0043ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, ROHS COMPLIANT, PLASTIC, D2PAK-3

AUIRLS4030TRR 数据手册

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PD - 96406B  
AUTOMOTIVE GRADE  
AUIRLS4030  
Features  
AUIRLSL4030  
l
Optimized for Logic Level Drive  
Advanced Process Technology  
UltraLowOn-Resistance  
HEXFET® Power MOSFET  
l
l
l
l
l
l
l
D
S
VDSS  
RDS(on) typ.  
max.  
100V  
175°COperatingTemperature  
Fast Switching  
3.4m  
4.3m  
Ω
Ω
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
G
ID  
180A  
Description  
Specifically designed for Automotive applications, this  
HEXFET® Power MOSFET utilizes the latest processing  
techniques to achieve extremely low on-resistance per  
siliconarea. Additionalfeaturesofthisdesign area175°C  
junctionoperatingtemperature, fastswitchingspeedand  
improved repetitive avalanche rating . These features  
combine to make this design an extremely efficient and  
reliable device for use in Automotive applications and a  
wide variety of other applications.  
S
S
D
D
G
G
D2Pak  
AUIRLS4030  
TO-262  
AUIRLSL4030  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stressesbeyondthoselistedunder“AbsoluteMaximumRatings”maycausepermanentdamagetothedevice.Thesearestress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications  
is not implied.Exposuretoabsolute-maximum-ratedconditionsforextendedperiodsmayaffectdevicereliability. Thethermal  
resistanceandpowerdissipationratingsaremeasuredunderboardmountedandstillairconditions.Ambienttemperature(TA)  
is 25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
180  
130  
730  
Units  
A
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
PD @TC = 25°C  
W
370  
2.5  
± 16  
305  
Maximum Power Dissipation  
Linear Derating Factor  
Gate-to-Source Voltage  
Single Pulse Avalanche Energy (Thermally limited)  
Avalanche Current  
W/°C  
V
mJ  
A
VGS  
EAS  
IAR  
See Fig. 14, 15, 22a, 22b,  
Repetitive Avalanche Energy  
EAR  
mJ  
21  
dv/dt  
TJ  
V/ns  
Peak Diode Recovery  
Operating Junction and  
-55 to + 175  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds  
(1.6mm from case)  
°C  
300  
Thermal Resistance  
Parameter  
Typ.  
–––  
–––  
Max.  
0.40  
40  
Units  
°C/W  
Rθ  
Junction-to-Case  
JC  
Junction-to-Ambient (PCB Mount) , D2Pak  
RθJA  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
11/17/11  

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