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AUIRLZ24NSTRL PDF预览

AUIRLZ24NSTRL

更新时间: 2024-11-24 14:47:51
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英飞凌 - INFINEON /
页数 文件大小 规格书
12页 296K
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AUIRLZ24NSTRL 数据手册

 浏览型号AUIRLZ24NSTRL的Datasheet PDF文件第2页浏览型号AUIRLZ24NSTRL的Datasheet PDF文件第3页浏览型号AUIRLZ24NSTRL的Datasheet PDF文件第4页浏览型号AUIRLZ24NSTRL的Datasheet PDF文件第5页浏览型号AUIRLZ24NSTRL的Datasheet PDF文件第6页浏览型号AUIRLZ24NSTRL的Datasheet PDF文件第7页 
AUIRLZ24NS  
AUIRLZ24NL  
AUTOMOTIVE GRADE  
HEXFET® Power MOSFET  
Features  
D
l
l
l
l
l
l
Advanced Process Technology  
VDSS  
55V  
0.06  
Logic Level Gate Drive  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to Tjmax  
Lead-Free,RoHSCompliant  
Automotive Qualified *  
RDS(on) max.  
ID  
Ω
G
18A  
S
l
D
D
Description  
SpecificallydesignedforAutomotiveapplications,thisHEXFET®  
Power MOSFET utilizes the latest processing techniques to  
achieveextremelylowon-resistancepersiliconarea. Additional  
featuresofthisdesign area175°Cjunctionoperatingtempera-  
ture, fast switching speed and improved repetitive avalanche  
rating . These features combine to make this design an ex-  
tremely efficient and reliable device for use in Automotive  
S
D
S
G
G
TO-262  
AUIRLZ24NL  
D2Pak  
AUILZ24NS  
applications and a wide variety of other applications.  
Standard Pack  
Form  
Tube  
Base Part Number  
Package Type  
Orderable Part Number  
Quantity  
50  
800  
AUIRLZ24NS  
AUIRLZ24NSTRL  
AUIRLZ24NS  
AUIRLZ24NL  
D2-Pak  
TO-262  
Tape and Reel Left  
Tube  
50  
AUIRLZ24NL  
AbsoluteMaximumRatings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress  
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is  
not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal  
resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is  
25°C, unless otherwise specified.  
Parameter  
Continuous Drain Current, VGS @ 10V  
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
Max.  
18  
Units  
ID @ TC = 25°C  
ID @ TC = 100°C  
IDM  
13  
A
72  
3.8  
PD @TA = 25°C  
Maximum Power Dissipation  
Maximum Power Dissipation  
Linear Derating Factor  
W
W
45  
0.30  
P
D @TC = 25°C  
W/°C  
V
± 16  
VGS  
EAS  
IAR  
Gate-to-Source Voltage  
68  
Single Pulse Avalanche Energy  
Avalanche Current  
mJ  
A
11  
4.5  
EAR  
dv/dt  
TJ  
Repetitive Avalanche Energy  
Peak Diode Recovery  
mJ  
V/ns  
5.0  
-55 to + 175  
Operating Junction and  
°C  
TSTG  
Storage Temperature Range  
Soldering Temperature, for 10 seconds (1.6mm from case)  
300  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
3.3  
Units  
Rθ  
Junction-to-Case  
JC  
°C/W  
Rθ  
Junction-to-Ambient (PCB Mounted, steady-state)**  
–––  
40  
JA  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
1
www.irf.com © 2015 International Rectifier  
Submit Datasheet Feedback  
February 23, 2015  

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