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AUIRLZ44Z PDF预览

AUIRLZ44Z

更新时间: 2024-11-27 12:52:55
品牌 Logo 应用领域
英飞凌 - INFINEON /
页数 文件大小 规格书
12页 221K
描述
AUTOMOTIVE GRADE

AUIRLZ44Z 技术参数

是否Rohs认证: 符合生命周期:End Of Life
包装说明:ROHS COMPLIANT, PLASTIC PACKAGE-3Reach Compliance Code:compliant
ECCN代码:EAR99Factory Lead Time:16 weeks
风险等级:5.51其他特性:ULTRA-LOW RESISTANCE
雪崩能效等级(Eas):78 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:55 V
最大漏极电流 (Abs) (ID):51 A最大漏极电流 (ID):51 A
最大漏源导通电阻:0.0135 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-220ABJESD-30 代码:R-PSFM-T3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:FLANGE MOUNT峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):80 W
最大脉冲漏极电流 (IDM):204 A子类别:FET General Purpose Power
表面贴装:NO端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管应用:SWITCHING晶体管元件材料:SILICON
Base Number Matches:1

AUIRLZ44Z 数据手册

 浏览型号AUIRLZ44Z的Datasheet PDF文件第2页浏览型号AUIRLZ44Z的Datasheet PDF文件第3页浏览型号AUIRLZ44Z的Datasheet PDF文件第4页浏览型号AUIRLZ44Z的Datasheet PDF文件第5页浏览型号AUIRLZ44Z的Datasheet PDF文件第6页浏览型号AUIRLZ44Z的Datasheet PDF文件第7页 
PD - 97682  
AUTOMOTIVE GRADE  
AUIRLZ44Z  
Features  
HEXFET® Power MOSFET  
Advanced Process Technology  
UltraLowOn-Resistance  
175°COperatingTemperature  
Fast Switching  
Repetitive Avalanche Allowed up to  
Tjmax  
D
V(BR)DSS  
RDS(on) typ.  
55V  
11m  
Ω
G
max.  
ID  
13.5m  
Ω
S
Lead-Free,RoHSCompliant  
Automotive Qualified *  
51A  
Description  
D
Specifically designed for Automotive applications,  
this HEXFET® Power MOSFET utilizes the latest  
processing techniques to achieve extremely low on-  
resistance per silicon area. Additional features of  
this design are a 175°C junction operating tempera-  
ture, fast switching speed and improved repetitive  
avalanche rating . These features combine to make  
this design an extremely efficient and reliable device  
for use in Automotive applications and a wide variety  
of other applications.  
S
D
G
TO-220AB  
AUIRLZ44Z  
G
D
S
Gate  
Drain  
Source  
Absolute Maximum Ratings  
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These  
are stress ratings only; and functional operation of the device at these or any other condition beyond those indicated in  
the specifications is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device  
reliability. The thermal resistance and power dissipation ratings are measured under board mounted and still air conditions.  
Ambient temperature (TA) is 25°C, unless otherwise specified.  
Parameter  
Max.  
51  
Units  
A
Continuous Drain Current, VGS @ 10V  
I
I
I
@ T = 25°C  
C
D
D
Continuous Drain Current, VGS @ 10V  
Pulsed Drain Current  
@ T = 100°C  
C
36  
204  
80  
DM  
P
@T = 25°C  
Power Dissipation  
C
W
D
Linear Derating Factor  
Gate-to-Source Voltage  
0.53  
± 16  
W/°C  
V
V
GS  
EAS(Thermally Limited)  
78  
110  
mJ  
Single Pulse Avalanche Energy  
EAS (tested )  
Single Pulse Avalanche Energy Tested Value  
Avalanche Current  
IAR  
See Fig.12a, 12b, 15, 16  
A
Repetitive Avalanche Energy  
EAR  
mJ  
T
J
Operating Junction and  
-55 to + 175  
T
Storage Temperature Range  
°C  
STG  
Soldering Temperature, for 10 seconds (1.6mm from case )  
Mounting Torque, 6-32 or M3 screw  
300  
10 lbf in (1.1N m)  
Thermal Resistance  
Parameter  
Typ.  
–––  
Max.  
1.87  
–––  
62  
Units  
RθJC  
Junction-to-Case  
RθCS  
RθJA  
0.50  
–––  
°C/W  
Case-to-Sink, Flat Greased Surface  
Junction-to-Ambient  
HEXFET® is a registered trademark of International Rectifier.  
*Qualification standards can be found at http://www.irf.com/  
www.irf.com  
1
06/10/11  

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