AUIRLZ24NS
AUIRLZ24NL
AUTOMOTIVE GRADE
HEXFET® Power MOSFET
Features
D
l
l
l
l
l
l
Advanced Process Technology
VDSS
55V
0.06
Logic Level Gate Drive
175°COperatingTemperature
Fast Switching
Repetitive Avalanche Allowed up to Tjmax
Lead-Free,RoHSCompliant
Automotive Qualified *
RDS(on) max.
ID
Ω
G
18A
S
l
D
D
Description
SpecificallydesignedforAutomotiveapplications,thisHEXFET®
Power MOSFET utilizes the latest processing techniques to
achieveextremelylowon-resistancepersiliconarea. Additional
featuresofthisdesign area175°Cjunctionoperatingtempera-
ture, fast switching speed and improved repetitive avalanche
rating . These features combine to make this design an ex-
tremely efficient and reliable device for use in Automotive
S
D
S
G
G
TO-262
AUIRLZ24NL
D2Pak
AUILZ24NS
applications and a wide variety of other applications.
Standard Pack
Form
Tube
Base Part Number
Package Type
Orderable Part Number
Quantity
50
800
AUIRLZ24NS
AUIRLZ24NSTRL
AUIRLZ24NS
AUIRLZ24NL
D2-Pak
TO-262
Tape and Reel Left
Tube
50
AUIRLZ24NL
AbsoluteMaximumRatings
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only; and functional operation of the device at these or any other condition beyond those indicated in the specifications is
not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The thermal
resistance and power dissipation ratings are measured under board mounted and still air conditions. Ambient temperature (TA) is
25°C, unless otherwise specified.
Parameter
Continuous Drain Current, VGS @ 10V
Continuous Drain Current, VGS @ 10V
Pulsed Drain Current
Max.
18
Units
ID @ TC = 25°C
ID @ TC = 100°C
IDM
13
A
72
3.8
PD @TA = 25°C
Maximum Power Dissipation
Maximum Power Dissipation
Linear Derating Factor
W
W
45
0.30
P
D @TC = 25°C
W/°C
V
± 16
VGS
EAS
IAR
Gate-to-Source Voltage
68
Single Pulse Avalanche Energy
Avalanche Current
mJ
A
11
4.5
EAR
dv/dt
TJ
Repetitive Avalanche Energy
Peak Diode Recovery
mJ
V/ns
5.0
-55 to + 175
Operating Junction and
°C
TSTG
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
300
Thermal Resistance
Parameter
Typ.
–––
Max.
3.3
Units
Rθ
Junction-to-Case
JC
°C/W
Rθ
Junction-to-Ambient (PCB Mounted, steady-state)**
–––
40
JA
HEXFET® is a registered trademark of International Rectifier.
*Qualification standards can be found at http://www.irf.com/
1
www.irf.com © 2015 International Rectifier
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February 23, 2015