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APTGLQ200H65G PDF预览

APTGLQ200H65G

更新时间: 2024-11-24 21:16:23
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网电动机控制晶体管
页数 文件大小 规格书
6页 536K
描述
Insulated Gate Bipolar Transistor

APTGLQ200H65G 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-XUFM-X13Reach Compliance Code:compliant
风险等级:5.73外壳连接:ISOLATED
最大集电极电流 (IC):270 A集电极-发射极最大电压:650 V
配置:BRIDGE, 4 ELEMENTS WITH BUILT-IN DIODE门极发射器阈值电压最大值:5.6 V
门极-发射极最大电压:20 VJESD-30 代码:R-XUFM-X13
元件数量:4端子数量:13
最高工作温度:150 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):680 W表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
晶体管应用:MOTOR CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):249 ns标称接通时间 (ton):48 ns
VCEsat-Max:2.3 VBase Number Matches:1

APTGLQ200H65G 数据手册

 浏览型号APTGLQ200H65G的Datasheet PDF文件第2页浏览型号APTGLQ200H65G的Datasheet PDF文件第3页浏览型号APTGLQ200H65G的Datasheet PDF文件第4页浏览型号APTGLQ200H65G的Datasheet PDF文件第5页浏览型号APTGLQ200H65G的Datasheet PDF文件第6页 
APTGLQ200H65G  
Full bridge  
High speed Trench + Field Stop IGBT4  
Power Module  
VCES = 650V  
IC = 200A @ Tc = 60°C  
Application  
VBUS  
Welding converters  
Q1  
Q2  
Q3  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
G1  
E1  
G3  
E3  
OUT1 OUT2  
Features  
High speed Trench + Field Stop IGBT 4 Technology  
-
-
-
Low voltage drop  
Low leakage current  
Low switching losses  
Q4  
G2  
E2  
G4  
E4  
Very low stray inductance  
Kelvin emitter for easy drive  
0/VBUS  
Benefits  
Stable temperature behavior  
Very rugged  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Easy paralleling due to positive TC of VCEsat  
Low profile  
RoHS Compliant  
All ratings @ Tj = 25°C unless otherwise specified  
Absolute maximum ratings (per IGBT)  
Symbol  
Parameter  
Collector - Emitter Voltage  
Max ratings  
650  
Unit  
V
VCES  
TC = 25°C  
TC = 60°C  
TC = 25°C  
270  
200  
540  
±20  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Power Dissipation  
V
W
680  
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
1 – 6  
www.microsemi.com  

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