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APTGLQ50H65T1G PDF预览

APTGLQ50H65T1G

更新时间: 2024-11-24 14:50:55
品牌 Logo 应用领域
美高森美 - MICROSEMI 局域网电动机控制晶体管
页数 文件大小 规格书
6页 475K
描述
Insulated Gate Bipolar Transistor

APTGLQ50H65T1G 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:FLANGE MOUNT, R-XUFM-X12Reach Compliance Code:compliant
风险等级:5.63外壳连接:ISOLATED
最大集电极电流 (IC):70 A集电极-发射极最大电压:650 V
配置:COMPLEX门极发射器阈值电压最大值:5.6 V
门极-发射极最大电压:20 VJESD-30 代码:R-XUFM-X12
元件数量:4端子数量:12
最高工作温度:150 °C最低工作温度:-40 °C
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
最大功率耗散 (Abs):175 W表面贴装:NO
端子形式:UNSPECIFIED端子位置:UPPER
晶体管应用:MOTOR CONTROL晶体管元件材料:SILICON
标称断开时间 (toff):249 ns标称接通时间 (ton):48 ns
VCEsat-Max:2.3 VBase Number Matches:1

APTGLQ50H65T1G 数据手册

 浏览型号APTGLQ50H65T1G的Datasheet PDF文件第2页浏览型号APTGLQ50H65T1G的Datasheet PDF文件第3页浏览型号APTGLQ50H65T1G的Datasheet PDF文件第4页浏览型号APTGLQ50H65T1G的Datasheet PDF文件第5页浏览型号APTGLQ50H65T1G的Datasheet PDF文件第6页 
APTGLQ50H65T1G  
Full bridge  
High speed Trench + Field Stop IGBT4  
Power Module  
VCES = 650V  
IC = 50A @ Tc = 60°C  
3
4
Application  
Welding converters  
Q3  
Switched Mode Power Supplies  
Uninterruptible Power Supplies  
Motor control  
Q1  
Q2  
CR1  
6
CR3  
1
2
9
5
7
Features  
Q4  
High speed Trench + Field Stop IGBT 4 Technology  
CR2 CR4  
-
-
-
Low voltage drop  
Low leakage current  
Low switching losses  
Very low stray inductance  
Internal thermistor for temperature monitoring  
8
10  
Benefits  
12  
NTC  
11  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for easy  
PCB mounting  
Low profile  
RoHS compliant  
Pins 3/4 must be shorted together  
All ratings @ Tj = 25°C unless otherwise specified  
Absolute maximum ratings (per IGBT)  
Symbol  
Parameter  
Collector - Emitter Voltage  
Max ratings  
Unit  
V
VCES  
650  
70  
50  
140  
±20  
175  
TC = 25°C  
TC = 60°C  
TC = 25°C  
IC  
Continuous Collector Current  
A
ICM  
VGE  
PD  
Pulsed Collector Current  
Gate – Emitter Voltage  
Power Dissipation  
V
W
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
1 - 6  
www.microsemi.com  

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