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2SC6026MFV-GR(L3SM PDF预览

2SC6026MFV-GR(L3SM

更新时间: 2024-11-06 14:39:23
品牌 Logo 应用领域
东芝 - TOSHIBA 放大器光电二极管晶体管
页数 文件大小 规格书
4页 162K
描述
Small Signal Bipolar Transistor, 0.15A I(C), 50V V(BR)CEO, 1-Element, NPN, Silicon

2SC6026MFV-GR(L3SM 技术参数

生命周期:Obsolete包装说明:SMALL OUTLINE, R-PDSO-F3
Reach Compliance Code:unknown风险等级:5.68
最大集电极电流 (IC):0.15 A集电极-发射极最大电压:50 V
配置:SINGLE最小直流电流增益 (hFE):200
JESD-30 代码:R-PDSO-F3元件数量:1
端子数量:3封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
极性/信道类型:NPN表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:SILICON
标称过渡频率 (fT):60 MHzBase Number Matches:1

2SC6026MFV-GR(L3SM 数据手册

 浏览型号2SC6026MFV-GR(L3SM的Datasheet PDF文件第2页浏览型号2SC6026MFV-GR(L3SM的Datasheet PDF文件第3页浏览型号2SC6026MFV-GR(L3SM的Datasheet PDF文件第4页 
2SC6026MFV  
TOSHIBA Transistor Silicon NPN Epitaxial Type (PCT Process)  
2SC6026MFV  
General-Purpose Amplifier Applications  
Unit: mm  
1.2 ± 0.05  
High voltage and high current  
: VCEO = 50 V, IC = 150 mA (max)  
Excellent h linearity :  
0.80 ± 0.05  
FE  
h
FE  
(I = 0.1 mA)/h (I = 2 mA) = 0.95 (typ.)  
C FE C  
High h  
h
= 120 to 400  
1
FE  
:
FE  
Complementary to 2SA2154MFV  
3
2
Absolute Maximum Ratings (Ta = 25°C)  
Characteristic  
Symbol  
Rating  
Unit  
Collector-base voltage  
Collector-emitter voltage  
Emitter-base voltage  
Collector current  
V
V
V
60  
50  
V
V
CBO  
CEO  
EBO  
1.BASE  
2.EMITTER  
3.COLLECTOR  
5
V
I
150  
mA  
mA  
mW  
°C  
°C  
VESM  
C
Base current  
I
30  
B
Collector power dissipation  
Junction temperature  
Storage temperature range  
P
150*  
150  
C
JEDEC  
JEITA  
T
j
T
55 to 150  
stg  
TOSHIBA  
2-1L1A  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change  
in temperature, etc.) may cause this product to decrease in  
Weight: 1.5 mg (typ.)  
the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are  
within the absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
* : Mounted on FR4 board (25.4 mm × 25.4 mm × 1.6mmt)  
Mount Pad Dimensions (Reference)  
0.5  
0.45  
1.15  
0.4  
0.45  
0.4  
0.4  
Unit: mm  
Start of commercial production  
2005-02  
1
2014-03-01  

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