NOT RECOMMENDED FOR NEW DESIGN
USE DMN65D8LDW
2N7002DWA
Marking Information
MM4 YM
M Y 4 M M
MM1 YM
M Y 1 M M
MM0 YM
M Y 0 M M
MM1 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: E = 2017)
MM4 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: E = 2017)
MM0 = Product Type Marking Code
YM = Date Code Marking
Y = Year (ex: E = 2017)
M = Month (ex: 9 = September)
M = Month (ex: 9 = September)
M = Month (ex: 9 = September)
Date Code Key
Year
2012
-
2017
2018
2019
2020
2021
2022
2023
2024
Code
Z
-
E
F
G
H
I
J
K
L
Month
Code
Jan
1
Feb
2
Mar
3
Apr
4
May
5
Jun
6
Jul
7
Aug
8
Sep
9
Oct
O
Nov
N
Dec
D
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
VDSS
Value
60
Unit
V
V
Drain-Source Voltage
Gate-Source Voltage
Steady
±20
VGSS
TA = +25°C
180
140
mA
mA
mA
Continuous Drain Current (Note 6)
Continuous Drain Current (Note 6)
Continuous Drain Current (Note 7)
Continuous Drain Current (Note 7)
VGS = 10V
VGS = 5V
VGS = 10V
VGS = 5V
ID
ID
ID
State
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
TA = +25°C
TA = +70°C
Steady
State
150
120
Steady
State
200
160
Steady
State
170
140
mA
mA
ID
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
700
IDM
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 6)
Symbol
PD
Value
300
435
Unit
mW
°C/W
mW
Thermal Resistance, Junction to Ambient (Note 6)
Total Power Dissipation (Note 7)
RθJA
400
PD
Thermal Resistance, Junction to Ambient (Note 7)
Thermal Resistance, Junction to Case (Note 7)
Operating and Storage Temperature Range
330
°C/W
°C/W
°C
RθJA
139
RθJC
-55 to +150
TJ, TSTG
Notes:
6. Device mounted on FR-4 PC board, with minimum recommended pad layout, single sided.
7. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper pad layout.
2 of 7
www.diodes.com
March 2017
© Diodes Incorporated
2N7002DWA
Document number: DS36120 Rev. 9 - 3