2N7002E
Small Signal MOSFET
60 V, 310 mA, Single, N−Channel, SOT−23
Features
• Low R
DS(on)
http://onsemi.com
• Small Footprint Surface Mount Package
• Trench Technology
V
R
DS(on)
MAX
I MAX
D
(Note 1)
(BR)DSS
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
60 V
3.0 W @ 4.5 V
2.5 W @ 10 V
310 mA
Applications
• Low Side Load Switch
• Level Shift Circuits
Simplified Schematic
• DC−DC Converter
N−Channel
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.
3
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Rating
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
60
Unit
V
1
V
DSS
V
GS
20
V
Drain Current (Note 1)
Steady State
I
D
mA
2
T = 25°C
A
260
190
A
(Top View)
T = 85°C
t < 5 s
T = 25°C
A
310
220
A
T = 85°C
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
Power Dissipation (Note 1)
Steady State
t < 5 s
P
D
mW
3
300
420
3
1
Pulsed Drain Current (t = 10 ms)
I
1.2
A
p
DM
703 MG
2
Operating Junction and Storage
Temperature Range
T , T
−55 to
°C
J
STG
G
+150
SOT−23
CASE 318
STYLE 21
1
2
Source Current (Body Diode)
I
S
300
260
mA
Gate
Source
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
°C
L
703
M
G
= Device Code
= Date Code
= Pb−Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
(Note: Microdot may be in either location)
THERMAL CHARACTERISTICS
ORDERING INFORMATION
Characteristic
Symbol
Max
Unit
†
Device
2N7002ET1G
Package
Shipping
Junction−to−Ambient − Steady State
(Note 1)
R
q
JA
417
°C/W
SOT−23
3000/Tape & Reel
(Pb−Free)
Junction−to−Ambient − t ≤ 5 s (Note 1)
R
q
JA
300
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
©
Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
February, 2011 − Rev. 3
2N7002E/D