Datasheet > 2N7002ET1G

2N7002ET1G

更新时间： 2022-12-24 12:42:02

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
5页	100K
描述
Small Signal MOSFET 60 V, 310 mA, Single, N−Channel, SOT−23

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2N7002ET1G 数据手册

2N7002E

Small Signal MOSFET

60 V, 310 mA, Single, N−Channel, SOT−23

Features

• Low R

DS(on)

http://onsemi.com

• Small Footprint Surface Mount Package

• Trench Technology

• This is a Pb−Free Device

DS(on)

MAX

I MAX

(Note 1)

(BR)DSS

60 V

3.0 W @ 4.5 V

2.5 W @ 10 V

310 mA

Applications

• Low Side Load Switch

• Level Shift Circuits

• DC−DC Converter

Simplified Schematic

• Portable Applications i.e. DSC, PDA, Cell Phone, etc.

N−Channel

MAXIMUM RATINGS (T = 25°C unless otherwise stated)

Rating

Drain−to−Source Voltage

Gate−to−Source Voltage

Symbol

Value

Unit

DSS

±20

Drain Current (Note 1)

Steady State

T = 25°C

260

190

T = 85°C

(Top View)

t < 5 s

T = 25°C

310

220

T = 85°C

MARKING DIAGRAM

& PIN ASSIGNMENT

Power Dissipation (Note 1)

Steady State

t < 5 s

300

420

Drain

Pulsed Drain Current (t = 10 ms)

1.2

Operating Junction and Storage

Temperature Range

T , T

−55 to

+150

°C

STG

703 W

SOT−23

Source Current (Body Diode)

300

260

CASE 318

STYLE 21

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

°C

Gate

Source

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

703

= Device Code

= Work Week

THERMAL CHARACTERISTICS

ORDERING INFORMATION

Characteristic

Symbol

Max

Unit

†

Device

Package

Shipping

Junction−to−Ambient − Steady State

(Note 1)

417

°C/W

2N7002ET1G

SOT−23

(Pb−Free)

3000/Tape & Reel

Junction−to−Ambient − t ≤ 5 s (Note 1)

300

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in

sq [1 oz] including traces)

Semiconductor Components Industries, LLC, 2007

Publication Order Number:

April, 2007 − Rev. 1

2N7002E/D

12 3 4 5

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