STT3402N
6.3 A, 30 V, RDS(ON) 27 m
N-Channel Enhancement Mode Mos.FET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
TSOP-6
DESCRIPTION
These miniature surface mount MOSFETs utilize High Cell Density
process. Low RDS(on) assures minimal power loss and conserves energy,
making this device ideal for use in power management circuitry. Typical
applications are power switch, power management in portable and
battery-powered products such as computers, printers, PCMCIA cards,
cellular and cordless telephones.
A
E
L
6
5
4
B
1
2
3
TYPICAL APPLICATIONS
F
C
H
J
Low RDS(on) Provides Higher Efficiency and
Extends Battery Life.
K
D G
Low Gate Charge.
Fast Switch.
Miniature TSOP-6 Surface Mount Package
Saves Board Space.
Millimeter
Min. Max.
Millimeter
REF.
REF.
Min.
Max.
A
B
C
D
E
F
2.70
2.60
1.40
3.10
3.00
1.80
G
H
J
K
L
0
0.10
0.60 REF.
0.12 REF.
1.10 MAX.
1.90 REF.
0°
10°
PRODUCT SUMMARY
0.95 REF.
0.30
0.50
STT3402N
ID(A)
6.3
5.5
VDS(V)
30
RDS(on) (m
0.027@VGS= 10V
0.035@VGS= 4.5V
D
D
G
D
D
S
PACKAGE INFORMATION
Package
MPQ
3K
LeaderSize
TSOP-6
7’ inch
ABSOLUTE MAXIMUM RATINGS(TA=25°C UNLESS OTHERWISE NOTED)
Ratings
Maximum
30
Parameter
Symbol
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
V
V
±20
TA= 25°C
TA= 70°C
6.3
5.2
±20
1.3
1.6
1.0
Continuous Drain Current 1
ID
A
Pulsed Drain Current 2
Continuous Source Current (Diode Conduction) 1
Power Dissipation 1
IDM
IS
A
A
TA= 25°C
TA= 70°C
W
PD
Operating Junction and Storage Temperature Range
Tj, Tstg
-55 ~ 150
°C
THERMAL RESISTANCE RATINGS
Symbol
Parameter
Maximum
Unit
Maximum Junction to Ambient 1
t ≦ 5 sec
RJA
78
°C / W
Notes
1
2
Surface Mounted on 1” x 1” FR4 Board.
Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
19-Nov-2010 Rev. A
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