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STT3458N PDF预览

STT3458N

更新时间: 2024-02-20 21:25:48
品牌 Logo 应用领域
SECOS /
页数 文件大小 规格书
4页 420K
描述
3.4A , 60V , RDS(ON) 92 m N-Channel Enhancement Mode Mos.FET

STT3458N 数据手册

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STT3458N  
3.4A , 60V , RDS(ON) 92 m  
N-Channel Enhancement Mode Mos.FET  
Elektronische Bauelemente  
RoHS Compliant Product  
A suffix of “-C” specifies halogen and lead-free  
DESCRIPTION  
TSOP-6  
These miniature surface mount MOSFETs utilize  
A
E
High Cell Density process. Low RDS(on) assures minimal  
power loss and conserves energy, making this device  
ideal for use in power management circuitry.  
L
6
5
4
B
FEATURES  
Low RDS(on) provides higher efficiency and extends  
battery life.  
1
2
3
F
C
H
J
Low gate charge  
Fast switch  
Miniature TSOP-6 surface mount package  
saves board space  
K
D G  
Millimeter  
Min. Max.  
Millimeter  
REF.  
REF.  
Min.  
Max.  
A
B
C
D
E
F
2.70  
2.60  
1.40  
1.10 MAX.  
1.90 REF.  
3.10  
3.00  
1.80  
G
H
J
K
L
0
0.10  
APPLICATION  
Power switch, power management in portable  
and battery-powered products such as computers,  
0.60 REF.  
0.12 REF.  
0°  
10°  
0.95 REF.  
0.30  
0.50  
printers, PCMCIA cards, cellular and cordless telephones.  
D
D
G
D
D
S
PACKAGE INFORMATION  
Package  
MPQ  
Leader Size  
TSOP-6  
3K  
7 inch  
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)  
Parameter  
Symbol  
VDS  
Ratings  
60  
Unit  
V
Drain-Source Voltage  
Gate-Source Voltage  
VGS  
±20  
V
TA= 25°C  
TA= 70°C  
3.4  
Continuous Drain Current 1  
ID  
A
2.7  
Pulsed Drain Current 2  
IDM  
IS  
±15  
A
A
Continuous Source Current (Diode Conduction) 1  
Power Dissipation 1  
1.7  
TA= 25°C  
TA= 70°C  
2
PD  
W
1.3  
Operating Junction and Storage Temperature Range  
TJ, TSTG  
-55 ~ 150  
°C  
Thermal Resistance Ratings  
t5 sec  
62.5  
110  
Maximum Junction to Ambient 1  
RθJA  
°C / W  
Steady State  
Notes  
1. Surface Mounted on 1” x 1” FR4 Board.  
2. Pulse width limited by maximum junction temperature.  
http://www.SeCoSGmbH.com/  
Any changes of specification will not be informed individually.  
05-Mar-2012 Rev. B  
Page 1 of 4  

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