STT3405P
-4.9 A, -20 V, RDS(ON) 56 m
P-Channel Enhancement Mode MOSFET
Elektronische Bauelemente
RoHS Compliant Product
A suffix of “-C” specifies halogen and lead-free
DESCRIPTION
TSOP-6
These miniature surface mount MOSFETs utilize
A
E
a high cell density process. Low RDS(on) assures minimal
power loss and conserves energy, making this device
ideal for use in power management circuitry. Typical
applications are PWMDC-DC converters, power management
in portable and battery-powered products such as computers,
printers, battery charger, telecommunication power system,
and telephones power system.
L
6
5
4
B
1
2
3
F
C
H
J
K
D G
FEATURES
Low RDS(on) provides higher efficiency and extends
battery life.
Miniature TSOP-6 surface mount package saves
board space.
Millimeter
Min. Max.
Millimeter
REF.
REF.
Min.
Max.
A
B
C
D
E
F
2.70
2.60
1.40
3.10
3.00
1.80
G
H
J
K
L
0
0.10
0.60 REF.
0.12 REF.
High power and current handling capability.
1.10 MAX.
1.90 REF.
0°
10°
0.95 REF.
0.30
0.50
PACKAGE INFORMATION
Package
MPQ
3K
LeaderSize
TSOP-6
7’ inch
D
D
D
D
G
S
ABSOLUTE MAXIMUM RATINGS (TA=25°C unless otherwise specified)
Parameter
Symbol
Ratings
Unit
Drain-Source Voltage
Gate-Source Voltage
VDS
VGS
-20
±12
V
V
TA= 25°C
TA= 70°C
-4.9
-4.0
-20
-1.7
2
1.3
Continuous Drain Current 1
ID
A
Pulsed Drain Current 2
Continuous Source Current (Diode Conduction) 1
Power Dissipation 1
IDM
IS
A
A
TA= 25°C
TA= 70°C
PD
W
Operating Junction and Storage Temperature Range
Tj, Tstg
-55 ~ 150
°C
Thermal Resistance Ratings
62.5
110
Maximum Junction to Ambient 1
t ≦ 5 sec
RJA
°C / W
Notes:
1. Surface Mounted on 1” x 1” FR4 Board.
2. Pulse width limited by maximum junction temperature.
http://www.SeCoSGmbH.com/
Any changes of specification will not be informed individually.
06-Jan-2011 Rev. A
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