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STD3NB30 PDF预览

STD3NB30

更新时间: 2024-10-02 22:29:07
品牌 Logo 应用领域
意法半导体 - STMICROELECTRONICS /
页数 文件大小 规格书
8页 87K
描述
N - CHANNEL 300V - 1.8ohm - 3.2A - DPAK PowerMESH MOSFET

STD3NB30 数据手册

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STD3NB30  
N - CHANNEL 300V - 1.8  
- 3.2A - DPAK  
PowerMESH MOSFET  
TYPE  
VDSS  
RDS(on)  
ID  
STD3NB30  
300 V  
< 2Ω  
3.2 A  
TYPICAL RDS(on) =1.8 Ω  
EXTREMELY HIGH dv/dt CAPABILITY  
100% AVALANCHE TESTED  
VERY LOW INTRINSIC CAPACITANCES  
GATE CHARGE MINIMIZED  
ADD SUFFIX ”T4” FOR ORDERING IN TAPE  
& REEL (2500 UNITS)  
3
1
DESCRIPTION  
DPAK  
TO-252  
(Suffix ”T4”)  
Using the latest high voltage MESH OVERLAY  
process, STMicroelectronics has designed an  
advanced family of power MOSFETs with  
outstanding performances. The new patent  
pending strip layout coupled with the Company’s  
proprietary edge termination structure, gives the  
lowest RDS(on) per area, exceptional avalanche  
and dv/dt capabilities and unrivalled gate charge  
and switching characteristics.  
INTERNAL SCHEMATIC DIAGRAM  
APPLICATIONS  
SWITCH MODE POWER SUPPLIES (SMPS)  
DC-AC CONVERTERS FOR WELDING  
EQUIPMENT AND UNINTERRUPTIBLE  
POWER SUPPLIES AND MOTOR DRIVE  
ABSOLUTE MAXIMUM RATINGS  
Symbol  
VDS  
VDGR  
VGS  
ID  
Parameter  
Value  
300  
Unit  
V
Drain-source Voltage (VGS = 0)  
Drain- gate Voltage (RGS = 20 k)  
Gate-source Voltage  
300  
V
± 30  
3.2  
V
o
Drain Current (continuous) at Tc = 25 C  
Drain Current (continuous) at Tc = 100 oC  
Drain Current (pulsed)  
A
ID  
2
A
I
DM()  
12.8  
40  
A
o
Ptot  
Total Dissipation at Tc = 25 C  
W
Derating Factor  
0.32  
5.5  
W/oC  
V/ns  
oC  
oC  
dv/dt(1) Peak Diode Recovery voltage slope  
Tstg  
Tj  
Storage Temperature  
-65 to 150  
Max. Operating Junction Temperature  
150  
() Pulse width limited by safe operating area  
( ) ISD 3.2A, di/dt 200 A/µs, VDD V(BR)DSS, Tj TJMAX  
1
1/8  
January 1999  

STD3NB30 替代型号

型号 品牌 替代类型 描述 数据表
IRFU214 INTERSIL

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