是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, BGA96,6X16,32 |
针数: | 96 | Reach Compliance Code: | unknown |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.33 |
其他特性: | 14 BIT 1:2 CONFIGURATION ALSO POSSIBLE | 系列: | SSTU |
JESD-30 代码: | R-PBGA-B96 | JESD-609代码: | e1 |
长度: | 13.5 mm | 逻辑集成电路类型: | D FLIP-FLOP |
湿度敏感等级: | 2 | 位数: | 25 |
功能数量: | 1 | 端子数量: | 96 |
最高工作温度: | 70 °C | 最低工作温度: | |
输出极性: | TRUE | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装等效代码: | BGA96,6X16,32 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 电源: | 1.8 V |
传播延迟(tpd): | 2 ns | 认证状态: | Not Qualified |
座面最大高度: | 1.5 mm | 子类别: | Other Logic ICs |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 触发器类型: | POSITIVE EDGE |
宽度: | 5.5 mm | 最小 fmax: | 450 MHz |
Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
PI74SSTUA32864NBE | PERICOM |
功能相似 |
25-Bit 1:1 or 14-Bit 1:2 Confi gurable Registered Buff er |
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