是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 96 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 5.83 | 系列: | SSTU |
JESD-30 代码: | R-PBGA-B96 | JESD-609代码: | e3 |
长度: | 11.5 mm | 逻辑集成电路类型: | D FLIP-FLOP |
位数: | 25 | 功能数量: | 1 |
端子数量: | 96 | 最高工作温度: | 70 °C |
最低工作温度: | 输出极性: | TRUE | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度): | 260 | 传播延迟(tpd): | 1.9 ns |
认证状态: | Not Qualified | 座面最大高度: | 1.2 mm |
最大供电电压 (Vsup): | 1.9 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
温度等级: | COMMERCIAL | 端子面层: | MATTE TIN |
端子形式: | BALL | 端子节距: | 0.65 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 30 |
触发器类型: | POSITIVE EDGE | 宽度: | 5 mm |
最小 fmax: | 410 MHz | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SSTUA32864BHMLF-T | IDT |
获取价格 |
D Flip-Flop, SSTU Series, 1-Func, Positive Edge Triggered, 25-Bit, True Output, PBGA96 | |
SSTUA32864BHM-T | IDT |
获取价格 |
Interface Circuit | |
SSTUA32864BH-T | IDT |
获取价格 |
Interface Circuit | |
SSTUA32864EC | NXP |
获取价格 |
1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32864EC,518 | NXP |
获取价格 |
SSTUA32864 - 1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32864EC,557 | NXP |
获取价格 |
SSTUA32864 - 1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32864EC/G | NXP |
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1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32864EG | NXP |
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1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32866 | NXP |
获取价格 |
1.8 V 25-bit 1 : 1 or 14-bit 1 : 2 configurable registered buffer with parity for DDR2-667 | |
SSTUA32866BHLFT | IDT |
获取价格 |
CABGA-96, Reel |