生命周期: | Obsolete | 零件包装代码: | BGA |
包装说明: | TFBGA, | 针数: | 160 |
Reach Compliance Code: | unknown | HTS代码: | 8542.39.00.01 |
风险等级: | 5.75 | 系列: | SSTU |
JESD-30 代码: | R-PBGA-B160 | 长度: | 13 mm |
逻辑集成电路类型: | D FLIP-FLOP | 位数: | 28 |
功能数量: | 1 | 端子数量: | 160 |
最高工作温度: | 70 °C | 最低工作温度: | |
输出特性: | OPEN-DRAIN | 输出极性: | TRUE |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | TFBGA |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, THIN PROFILE, FINE PITCH |
传播延迟(tpd): | 2.15 ns | 认证状态: | Not Qualified |
座面最大高度: | 1.2 mm | 最大供电电压 (Vsup): | 1.9 V |
最小供电电压 (Vsup): | 1.7 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 0.65 mm |
端子位置: | BOTTOM | 触发器类型: | POSITIVE EDGE |
宽度: | 9 mm | 最小 fmax: | 270 MHz |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
SSTU32865ET,557 | NXP |
获取价格 |
SSTU32865 - 1.8 V 28-bit 1:2 registered buffer with parity for DDR2 RDIMM applications BGA | |
SSTU32866 | NXP |
获取价格 |
1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for DDR2 RDIMM a | |
SSTU32866EC | NXP |
获取价格 |
1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for DDR2 RDIMM a | |
SSTU32866EC/G | NXP |
获取价格 |
1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for DDR2 RDIMM a | |
SSTU32866EC/G,518 | NXP |
获取价格 |
SSTU32866 - 1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for | |
SSTU32866EC/G,551 | NXP |
获取价格 |
SSTU32866 - 1.8 V 25-bit 1:1 or 14-bit 1:2 configurable registered buffer with parity for | |
SSTUA32864 | NXP |
获取价格 |
1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32864_07 | NXP |
获取价格 |
1.8 V configurable registered buffer for DDR2-667 RDIMM applications | |
SSTUA32864BHLF | IDT |
获取价格 |
CABGA-96, Tray | |
SSTUA32864BHLF-T | IDT |
获取价格 |
CABGA-96, Reel |