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SSM6J206FE(TPL3)

更新时间： 2024-02-08 13:52:45
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 190K
描述
TRANSISTOR,MOSFET,P-CHANNEL,20V V(BR)DSS,2A I(D),TSOP

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SSM6J206FE(TPL3) 技术参数

是否Rohs认证： 不符合生命周期：Active
包装说明：,Reach Compliance Code：unknown
风险等级：5.69配置：Single
最大漏极电流 (Abs) (ID)：2 AFET 技术：METAL-OXIDE SEMICONDUCTOR
工作模式：ENHANCEMENT MODE最高工作温度：150 °C
极性/信道类型：P-CHANNEL最大功率耗散 (Abs)：0.5 W
子类别：Other Transistors表面贴装：YES
Base Number Matches：1

SSM6J206FE(TPL3) 数据手册

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SSM6J206FE  
TOSHIBA Field-Effect Transistor Silicon P-Channel MOS Type  
SSM6J206FE  
○Power Management Switch Applications  
Unit: mm  
○High-Speed Switching Applications  
•
•
1.8 V drive  
Low ON-resistance: Ron = 320 mΩ (max) (@VGS = -1.8 V)  
Ron = 186 mΩ (max) (@VGS = -2.5 V)  
Ron = 130 mΩ (max) (@VGS = -4.0 V)  
Absolute Maximum Ratings (Ta = 25˚C)  
Characteristic  
Drain–source voltage  
Symbol  
Rating  
Unit  
V
-20  
± 8  
-2  
V
V
DS  
Gate–source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
-4  
DP  
P
(Note 1)  
Drain power dissipation  
D
500  
mW  
Channel temperature  
Storage temperature  
T
T
150  
°C  
°C  
ch  
−55 to 150  
1, 2, 5, 6 : Drain  
stg  
3
4
: Gate  
Note:  
Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
Please design the appropriate reliability upon reviewing the  
Toshiba Semiconductor Reliability Handbook (“Handling  
Precautions”/“Derating Concept and Methods”) and individual  
reliability data (i.e. reliability test report and estimated failure  
rate, etc).  
: Source  
ES6  
JEDEC  
JEITA  
―
―
TOSHIBA  
2-2N1A  
Weight: 3 mg (typ.)  
Note 1: Mounted on an FR4 board  
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm2)  
Electrical Characteristics (Ta = 25°C)  
Characteristic  
Symbol  
Test Condition  
Min  
Typ.  
Max  
Unit  
V
V
I
I
= -1 mA, V  
= -1 mA, V  
= 0  
-20  
-12  
⎯
⎯
⎯
⎯
⎯
⎯
(BR) DSS  
(BR) DSX  
D
D
GS  
GS  
Drain–source breakdown voltage  
V
= +8 V  
Drain cutoff current  
I
V
V
V
V
= -20 V, V  
= 0  
-10  
μA  
μA  
V
DSS  
DS  
GS  
DS  
DS  
GS  
= 0  
Gate leakage current  
Gate threshold voltage  
Forward transfer admittance  
I
= ±8 V, V  
⎯
-0.3  
2.4  
⎯
⎯
⎯
4
±1  
-1.0  
⎯
GSS  
DS  
V
= -3 V, I = -1 mA  
th  
D
⏐Y ⏐  
= -3 V, I = -1 A  
(Note 2)  
(Note 2)  
S
fs  
D
I
= -1.0 A, V  
= -4 V  
91  
130  
D
GS  
Drain–source ON-resistance  
R
mΩ  
DS (ON)  
I
I
= -0.5 A, V  
= -0.2 A, V  
= -2.5 V  
= -1.8 V  
(Note 2)  
(Note 2)  
⎯
⎯
130  
180  
186  
320  
D
D
GS  
GS  
Input capacitance  
C
V
V
V
= -10 V, V  
= -10 V, V  
= -10 V, V  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
= 0, f = 1 MHz  
⎯
⎯
⎯
⎯
335  
70  
⎯
⎯
⎯
pF  
pF  
iss  
DS  
DS  
DS  
GS  
GS  
GS  
Output capacitance  
C
oss  
pF  
ns  
V
Reverse transfer capacitance  
C
56  
rss  
Turn-on time  
t
t
V
V
= -10 V, I = -1 A,  
20  
20  
⎯
⎯
on  
DD  
GS  
D
Switching time  
= 0 to -2.5 V, R = 4.7 Ω  
G
Turn-off time  
Drain–source forward voltage  
Note 2: Pulse test  
⎯
⎯
off  
V
I
= 2 A, V = 0  
GS  
(Note 2)  
0.85  
1.2  
DSF  
D
1
2007-11-01  
12345

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