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SSM6J25FE(TPL3) PDF预览

SSM6J25FE(TPL3)

更新时间: 2024-11-13 15:52:55
品牌 Logo 应用领域
东芝 - TOSHIBA /
页数 文件大小 规格书
5页 164K
描述
SSM6J25FE(TPL3)

SSM6J25FE(TPL3) 技术参数

生命周期:Lifetime Buy包装说明:,
Reach Compliance Code:unknown风险等级:5.61
Base Number Matches:1

SSM6J25FE(TPL3) 数据手册

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SSM6J25FE  
TOSHIBA Field Effect Transistor Silicon P Channel MOS Type (U-MOSIII)  
SSM6J25FE  
High Speed Switching Applications  
Unit: mm  
Optimum for high-density mounting in small packages  
1.6±0.05  
1.2±0.05  
Low on-resistance:  
R
on  
on  
= 260m(max) (@V  
= 430m(max) (@V  
= -4 V)  
GS  
GS  
R
= -2.5 V)  
1
2
6
5
Absolute Maximum Ratings (Ta = 25°C)  
Characteristics  
Drain-Source voltage  
Symbol  
Rating  
Unit  
4
3
V
-20  
± 12  
-0.5  
-1.5  
V
V
DS  
Gate-Source voltage  
V
GSS  
DC  
I
D
Drain current  
A
Pulse  
I
DP  
P
D
Drain power dissipation  
Channel temperature  
500  
mW  
1,2,5,6 :Drain  
3 :Gate  
4 :Source  
(Note 1)  
T
ch  
150  
°C  
°C  
ES6  
Storage temperature range  
T
stg  
55~150  
JEDEC  
JEITA  
Note: Using continuously under heavy loads (e.g. the application of  
high temperature/current/voltage and the significant change in  
temperature, etc.) may cause this product to decrease in the  
reliability significantly even if the operating conditions (i.e.  
operating temperature/current/voltage, etc.) are within the  
absolute maximum ratings.  
TOSHIBA  
2-2N1A  
Weight: 3.0 mg (typ.)  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: Mounted on FR4 board.  
(25.4 mm × 25.4 mm × 1.6 t, Cu Pad: 645 mm )  
2
Marking  
Equivalent Circuit (top view)  
6
5
4
6
5
4
PH  
1
2
3
1
2
3
Handling Precaution  
When handling individual devices (which are not yet mounted on a circuit board), be sure that the environment is  
protected against electrostatic electricity. Operators should wear anti-static clothing, and containers and other objects  
that come into direct contact with devices should be made of anti-static materials.  
1
2007-11-01  

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