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SN74SSQEA32882

更新时间: 2024-11-24 06:12:59
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德州仪器 - TI 时钟驱动器测试双倍数据速率
页数 文件大小 规格书
6页 167K
描述
28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST ONE PAIR TO FOUR PAIR DIFFERENTIAL CLOCK PLL DRIVER

SN74SSQEA32882 数据手册

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SN74SSQEA32882  
www.ti.com ...................................................................................................................................................................................................... SCAS879JUNE 2009  
28-BIT TO 56-BIT REGISTERED BUFFER WITH ADDRESS PARITY TEST  
ONE PAIR TO FOUR PAIR DIFFERENTIAL CLOCK PLL DRIVER  
The SN74SSQEA32882 has two basic modes of  
operation associated with the Quad Chip Select  
Enable (QCSEN) input.  
1
FEATURES  
JEDEC SSTE32882 Compliant  
1-to-2 Register Outputs and 1-to-4 Clock Pair  
Outputs Support Stacked DDR3 DIMMs  
First, when the QCSEN input pin is open or pulled  
high, the component has two chip select inputs,  
DCS0 and DCS1, and two copies of each chip select  
output, QACS0, QACS1, QBCS0 and QBCS1. This  
mode is the QuadCS disabled mode. Alternatively,  
when the QCSEN input pin is pulled low, the  
component has four chip select inputs DCS[3:0], and  
four chip select outputs, QCS[3:0]. This mode is the  
QuadCS enabled mode.  
CKE Powerdown mode for optimized system  
power consumption  
1.5V/1.35V Phase Lock Loop Clock Driver  
Buffers One Differential Clock Pair (CK and  
CK) and Distributes to Four Differential  
Outputs  
1.5V/1.35V CMOS Inputs  
When QCSEN is high or floating, the device also  
supports an operating mode that allows a single  
device to be mounted on the back side of a DIMM  
array. This device can then be configured to keep the  
input bus termination (IBT) feature enabled for all  
input signals independent of MIRROR. The  
SN74SSQEA32882. operates from a differential clock  
(CK and CK). Data are registered at the crossing of  
CK going high and CK going low. This data can either  
be re-driven to the outputs or used to access internal  
control registers. Details are covered in the Function  
Tables (each flip-flop) with QCSEN = low.  
Checks Parity on Command and Address  
(CS-gated) Data Inputs  
Supports Four Chip Selects  
Configurable Driver Strength  
APPLICATIONS  
DDR3 Registered DIMMs up to DDR3-1600  
DDR3L Registered DIMMs up to DDR3L-1333  
Single-, Dual- and Quad-Rank RDIMM  
DESCRIPTION/ORDERING INFORMATION  
Input bus data integrity is protected by a parity  
function. All address and command input signals are  
summed; the last bit of the sum is then compared to  
the parity signal delivered by the system at the  
PAR_IN input one clock cycle later. If these two  
values do not match, the device pulls the open drain  
output ERROUT low. The control signals (DCKE0,  
DCKE1, DODT0, DODT1, and DCS[n:0]) are not part  
of this computation.  
This JEDEC SSTE32882-compliant, 28-bit 1:2 or  
26-bit 1:2 and 4-bit 1:1 registering clock driver with  
parity is designed for operation on DDR3 registered  
DIMMs with with VDD of 1.5 V and on DDR3L  
registered DIMMs with VDD of 1.35 V.  
The  
SN74SSQEA32882  
implements  
different  
power-saving mechanisms to reduce thermal power  
dissipation and to support system power-down states.  
Power consumption is further reduced by disabling  
unused outputs.  
The package design is optimal for high-density  
DIMMs. By aligning input and output positions  
towards DIMM finger-signal ordering and SDRAM  
ballout, the device de-scrambles the DIMM traces  
and allows low crosstalk designs with low  
interconnect latency. Edge-controlled outputs reduce  
ringing and improve signal eye opening at the  
SDRAM inputs.  
All inputs are 1.5V and 1.35V CMOS-compatible. All  
outputs are optimized to drive DRAM signals on  
terminated traces in DDR3 RDIMM applications.  
Clock outputs Yn and Yn and control net outputs  
DxCKEn, DxCSn, and DxODTn can each be driven  
with a different strength and skew to optimize signal  
integrity, compensate for different loading, and  
balance signal travel speed.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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