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SN74LVC2G126_08 PDF预览

SN74LVC2G126_08

更新时间: 2024-11-23 05:29:31
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德州仪器 - TI 输出元件
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12页 431K
描述
DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS

SN74LVC2G126_08 数据手册

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SN74LVC2G126  
DUAL BUS BUFFER GATE  
WITH 3-STATE OUTPUTS  
www.ti.com  
SCES205JAPRIL 1999REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Ioff Supports Partial-Power-Down Mode  
Operation  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 4 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
GND  
2Y  
2A  
1Y  
VCC  
2OE  
1Y  
1
2
3
4
8
7
6
5
1OE  
1A  
VCC  
2OE  
1Y  
1
2
3
4
8
7
6
5
1OE  
1A  
3 6  
2 7  
1 8  
1A  
2OE  
VCC  
2Y  
1OE  
GND  
2A  
2Y  
GND  
2A  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
The SN74LVC2G126 is a dual bus driver/line driver with 3-state outputs. The outputs are disabled when the  
associated output-enable (OE) input is low.  
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a  
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the  
driver.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74LVC2G126YZPR  
_ _ _CN_  
C26_ _ _  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G126DCTR  
SN74LVC2G126DCUR  
SN74LVC2G126DCUT  
–40°C to 85°C  
VSSOP – DCU  
C26_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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