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SN74LVC2G14_15 PDF预览

SN74LVC2G14_15

更新时间: 2024-11-20 02:58:19
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德州仪器 - TI /
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描述
Dual Schmitt-Trigger Inverter

SN74LVC2G14_15 数据手册

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SN74LVC2G14  
DUAL SCHMITT-TRIGGER INVERTER  
www.ti.com  
SCES200LAPRIL 1999REVISED JANUARY 2007  
FEATURES  
Available in the Texas Instruments  
NanoFree™ Package  
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
Supports 5-V VCC Operation  
Ioff Feature Supports Partial-Power-Down  
Mode Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.4 ns at 3.3 V  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
DBV PACKAGE  
(TOP VIEW)  
DCK PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
3
4
2Y  
2A  
GND  
1A  
1A  
GND  
2A  
1Y  
1
2
3
6
5
4
1
2
3
6
1A  
GND  
2A  
1Y  
V
2
1
5
6
V
CC  
V
CC  
1Y  
5
4
CC  
2Y  
2Y  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
The SN74LVC2G14 contains two inverters and performs the Boolean function Y = A. The device functions as  
two independent inverters, but because of Schmitt action, it may have different input threshold levels for  
positive-going (VT+) and negative-going (VT–) signals.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
Reel of 3000  
SN74LVC2G14YZPR  
_ _ _CF_  
C14_  
0.23-mm Large Bump – YZP (Pb-free)  
SOT (SOT-23) – DBV  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC2G14DBVR  
SN74LVC2G14DBVT  
SN74LVC2G14DCKR  
SN74LVC2G14DCKT  
–40°C to 85°C  
SOT (SC-70) – DCK  
CF_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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