SN74LVC2G14
DUAL SCHMITT-TRIGGER INVERTER
www.ti.com
SCES200L–APRIL 1999–REVISED JANUARY 2007
FEATURES
•
Available in the Texas Instruments
NanoFree™ Package
•
•
•
•
Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
•
•
•
•
•
•
Supports 5-V VCC Operation
Ioff Feature Supports Partial-Power-Down
Mode Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 5.4 ns at 3.3 V
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
ESD Protection Exceeds JESD 22
–
–
2000-V Human-Body Model (A114-A)
1000-V Charged-Device Model (C101)
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
DBV PACKAGE
(TOP VIEW)
DCK PACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOM VIEW)
3
4
2Y
2A
GND
1A
1A
GND
2A
1Y
1
2
3
6
5
4
1
2
3
6
1A
GND
2A
1Y
V
2
1
5
6
V
CC
V
CC
1Y
5
4
CC
2Y
2Y
See mechanical drawings for dimensions.
DESCRIPTION/ORDERING INFORMATION
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
The SN74LVC2G14 contains two inverters and performs the Boolean function Y = A. The device functions as
two independent inverters, but because of Schmitt action, it may have different input threshold levels for
positive-going (VT+) and negative-going (VT–) signals.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000
SN74LVC2G14YZPR
_ _ _CF_
C14_
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
SN74LVC2G14DBVR
SN74LVC2G14DBVT
SN74LVC2G14DCKR
SN74LVC2G14DCKT
–40°C to 85°C
SOT (SC-70) – DCK
CF_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.