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SN74LVC2G157DCT3 PDF预览

SN74LVC2G157DCT3

更新时间: 2024-11-21 11:06:23
品牌 Logo 应用领域
德州仪器 - TI 光电二极管逻辑集成电路复用器解复用器
页数 文件大小 规格书
13页 343K
描述
单路 2 线路至 1 线路数据选择器/多路复用器 | DCT | 8 | -40 to 85

SN74LVC2G157DCT3 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:LSSOP,
Reach Compliance Code:compliantFactory Lead Time:1 week
风险等级:5.6系列:LV/LV-A/LVX/H
JESD-30 代码:R-PDSO-G8JESD-609代码:e6
长度:2.95 mm逻辑集成电路类型:MULTIPLEXER
最大I(ol):0.032 A湿度敏感等级:1
功能数量:1输入次数:2
输出次数:1端子数量:8
最高工作温度:85 °C最低工作温度:-40 °C
输出极性:COMPLEMENTARY封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH传播延迟(tpd):14 ns
座面最大高度:1.3 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):1.65 V标称供电电压 (Vsup):3.3 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Bismuth (Sn/Bi)
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL宽度:2.8 mm
Base Number Matches:1

SN74LVC2G157DCT3 数据手册

 浏览型号SN74LVC2G157DCT3的Datasheet PDF文件第2页浏览型号SN74LVC2G157DCT3的Datasheet PDF文件第3页浏览型号SN74LVC2G157DCT3的Datasheet PDF文件第4页浏览型号SN74LVC2G157DCT3的Datasheet PDF文件第5页浏览型号SN74LVC2G157DCT3的Datasheet PDF文件第6页浏览型号SN74LVC2G157DCT3的Datasheet PDF文件第7页 
SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207IAPRIL 1999REVISED JUNE 2005  
FEATURES  
DCT OR DCU PACKAGE  
(TOP VIEW)  
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
A
B
Y
V
CC  
1
2
3
4
8
7
6
5
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 6 ns at 3.3 V  
G
A/B  
Y
GND  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
4
3
2
1
5
6
7
8
GND  
Y
Y
A/B  
G
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
B
A
Ioff Supports Partial-Power-Down Mode  
Operation  
V
CC  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This single 2-line to 1-line data selector/multiplexer is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G157 features a common strobe (G) input. When the strobe is high, Y is low and Y is high. When  
the strobe is low, a single bit is selected from one of two sources and is routed to the outputs. The device  
provides true and complementary data.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC2G157YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC2G157YZAR  
_ _ _C3_  
Reel of 3000  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC2G157YEPR  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC2G157YZPR  
SSOP – DCT  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G157DCTR  
SN74LVC2G157DCUR  
SN74LVC2G157DCUT  
C57_ _ _  
C57_  
VSSOP – DCU  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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