是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | DSBGA-8 | 针数: | 8 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 1 week |
风险等级: | 1.39 | Samacsys Confidence: | 4 |
Samacsys Status: | Released | Samacsys PartID: | 182171 |
Samacsys Pin Count: | 8 | Samacsys Part Category: | Integrated Circuit |
Samacsys Package Category: | BGA | Samacsys Footprint Name: | YZP (R-XBGA-N8) |
Samacsys Released Date: | 2015-11-26 09:35:24 | Is Samacsys: | N |
系列: | LV/LV-A/LVX/H | JESD-30 代码: | R-XBGA-B8 |
JESD-609代码: | e1 | 长度: | 1.9 mm |
负载电容(CL): | 50 pF | 逻辑集成电路类型: | MULTIPLEXER |
最大I(ol): | 0.032 A | 湿度敏感等级: | 1 |
位数: | 2 | 功能数量: | 1 |
输入次数: | 2 | 输出次数: | 1 |
端子数量: | 8 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 输出特性: | 3-STATE |
输出极性: | COMPLEMENTARY | 封装主体材料: | UNSPECIFIED |
封装代码: | VFBGA | 封装等效代码: | BGA8,2X4,20 |
封装形状: | RECTANGULAR | 封装形式: | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
包装方法: | TR | 峰值回流温度(摄氏度): | 260 |
电源: | 3.3 V | 最大电源电流(ICC): | 0.01 mA |
Prop。Delay @ Nom-Sup: | 6 ns | 传播延迟(tpd): | 14 ns |
认证状态: | Not Qualified | 座面最大高度: | 0.5 mm |
子类别: | Multiplexer/Demultiplexers | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 1.65 V | 标称供电电压 (Vsup): | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | INDUSTRIAL | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 0.5 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 0.9 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
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