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SN74LVC2G157_15

更新时间： 2024-11-19 02:58:51
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德州仪器 - TI /
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12页 393K
描述
Single 2-Line to 1-Line Data Selector Multiplexer

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SN74LVC2G157_15 数据手册

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SN74LVC2G157  
SINGLE 2-LINE TO 1-LINE DATA SELECTOR/MULTIPLEXER  
www.ti.com  
SCES207K–APRIL 1999–REVISED JANUARY 2007  
FEATURES  
•
Available in the Texas Instruments  
NanoFree™ Package  
•
•
•
•
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 6 ns at 3.3 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
ESD Protection Exceeds JESD 22  
–
–
2000-V Human-Body Model (A114-A)  
1000-V Charged-Device Model (C101)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
DCT PACKAGE  
(TOP VIEW)  
DCU PACKAGE  
(TOP VIEW)  
YZP PACKAGE  
(BOTTOM VIEW)  
4 5  
Y
A/B  
G
GND  
Y
B
A
B
Y
V
CC  
1
2
3
4
8
7
6
5
3 6  
1
2
8
7
A
B
V
CC  
G
A/B  
Y
2
7
A
1 8  
V
CC  
G
GND  
3
4
6
5
Y
A/B  
Y
GND  
See mechanical drawings for dimensions.  
DESCRIPTION/ORDERING INFORMATION  
This single 2-line to 1-line data selector/multiplexer is designed for 1.65-V to 5.5-V VCC operation.  
The SN74LVC2G157 features a common strobe (G) input. When the strobe is high, Y is low and Y is high.  
When the strobe is low, a single bit is selected from one of two sources and is routed to the outputs. The device  
provides true and complementary data.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SSOP – DCT  
Reel of 3000  
SN74LVC2G157YZPR  
_ _ _C3_  
C57_ _ _  
Reel of 3000  
Reel of 3000  
Reel of 250  
SN74LVC2G157DCTR  
SN74LVC2G157DCUR  
SN74LVC2G157DCUT  
–40°C to 85°C  
VSSOP – DCU  
C57_  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.  
DCU: The actual top-side marking has one additional character that designates the assembly/test site.  
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following  
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2007, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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