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SN74LVC2G14 PDF预览

SN74LVC2G14

更新时间： 2024-11-18 23:06:23
品牌 Logo 应用领域
德州仪器 - TI 触发器
页数 文件大小 规格书
15页 384K
描述
DUAL SCHMITT-TRIGGER INVERTER

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SN74LVC2G14 数据手册

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SN74LVC2G14  
DUAL SCHMITT-TRIGGER INVERTER  
www.ti.com  
SCES200J–APRIL 1999–REVISED JUNE 2005  
FEATURES  
DBV OR DCK PACKAGE  
(TOP VIEW)  
•
Available in the Texas Instruments  
NanoStar™ and NanoFree™ Packages  
1
2
3
6
5
4
1A  
GND  
2A  
1Y  
•
•
•
•
•
•
Supports 5-V VCC Operation  
V
CC  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.4 ns at 3.3 V  
2Y  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
YEA, YEP, YZA, OR YZP PACKAGE  
(BOTTOM VIEW)  
Typical VOLP (Output Ground Bounce)  
<0.8 V at VCC = 3.3 V, TA = 25°C  
3
2
1
4
5
6
2A  
GND  
1A  
2Y  
V
CC  
•
•
•
•
Typical VOHV (Output VOH Undershoot)  
>2 V at VCC = 3.3 V, TA = 25°C  
1Y  
Ioff Feature Supports Partial-Power-Down  
Mode Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
– 2000-V Human-Body Model (A114-A)  
– 1000-V Charged-Device Model (C101)  
DESCRIPTION/ORDERING INFORMATION  
This dual Schmitt-trigger inverter is designed for 1.65-V to 5.5-V VCC operation.  
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the  
die as the package.  
ORDERING INFORMATION  
TA  
PACKAGE(1)  
ORDERABLE PART NUMBER TOP-SIDE MARKING(2)  
NanoStar™ – WCSP (DSBGA)  
0.17-mm Small Bump – YEA  
SN74LVC2G14YEAR  
NanoFree™ – WCSP (DSBGA)  
0.17-mm Small Bump – YZA (Pb-free)  
SN74LVC2G14YZAR  
_ _ _CF_  
Reel of 3000  
NanoStar™ – WCSP (DSBGA)  
0.23-mm Large Bump – YEP  
SN74LVC2G14YEPR  
–40°C to 85°C  
NanoFree™ – WCSP (DSBGA)  
0.23-mm Large Bump – YZP (Pb-free)  
SN74LVC2G14YZPR  
Reel of 3000  
Reel of 250  
Reel of 3000  
Reel of 250  
SN74LVC2G14DBVR  
C14_  
SOT (SOT-23) – DBV  
SOT (SC-70) – DCK  
SN74LVC2G14DBVT  
SN74LVC2G14DCKR  
CF_  
SN74LVC2G14DCKT  
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at  
www.ti.com/sc/package.  
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.  
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one  
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
NanoStar, NanoFree are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 1999–2005, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
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