SN74LVC2G126-EP
www.ti.com
SCES856 –DECEMBER 2013
DUAL BUS BUFFER GATE WITH 3-STATE OUTPUTS
Check for Samples: SN74LVC2G126-EP
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FEATURES
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Supports 5-V VCC Operation
SUPPORTS DEFENSE, AEROSPACE,
AND MEDICAL APPLICATIONS
Inputs Accept Voltages to 5.5 V
Max tpd of 6.8 ns at 3.3 V
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Controlled Baseline
One Assembly and Test Site
One Fabrication Site
Low Power Consumption, 10-μA Max ICC
±24-mA Output Drive at 3.3 V
Available in Military (–55°C to 125°C)
Temperature Range
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA = 25°C
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Extended Product Life Cycle
Extended Product-Change Notification
Product Traceability
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Typical VOHV (Output VOH Undershoot)
>2 V at VCC = 3.3 V, TA = 25°C
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
DCU PACKAGE
(TOP VIEW)
ESD Protection Exceeds JESD 22
VCC
2OE
1Y
1
2
3
4
8
7
6
5
1OE
1A
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2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
2Y
GND
2A
1000-V Charged-Device Model (C101)
DESCRIPTION
This dual bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC2G126 is a dual bus driver/line driver with 3-state outputs. The outputs are disabled when the
associated output-enable (OE) input is low.
To ensure the high-impedance state during power up or power down, OE should be tied to GND through a
pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TJ
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
VID NUMBER
–55°C to 125°C
VSSOP - DCU Tape of 250
CLVC2G126MDCUTEP
CEPR
V62/14604-01XE
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Function Table
(Each Buffer)
INPUTS
OUTPUT
Y
OE
A
H
L
H
H
L
H
L
X
Z
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Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated