SN74LVC1G10
SINGLE 3-INPUT POSITIVE-NAND GATE
www.ti.com
SCES486D–SEPTEMBER 2003–REVISED JANUARY 2007
FEATURES
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Available in the Texas Instruments
NanoFree™ Package
Operation
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•
Latch-Up Performance Exceeds 100 mA per
JESD 78, Class II
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Supports 5-V VCC Operation
Inputs Accept Voltages to 5.5 V
Max tpd of 3.8 ns at 3.3 V
ESD Protection Exceeds JESD 22
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2000-V Human-Body Model (A114-A)
200-V Machine Model (A115-A)
Low Power Consumption, 10-µA Max ICC
±24-mA Output Drive at 3.3 V
1000-V Charged Device Model (C101)
Ioff Supports Partial-Power-Down Mode
DESCRIPTION/ORDERING INFORMATION
The SN74LVC1G10 performs the Boolean function Y = A • B • C or Y = A + B + C in positive logic.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
TOP-SIDE MARKING(2)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SOT (SOT-23) – DBV
Reel of 3000
SN74LVC1G10YZPR
_ _ _C2_
–40°C to 85°C
Reel of 3000
Reel of 3000
SN74LVC1G10DBVR
SN74LVC1G10DCKR
C10_
C2_
SOT (SC-70) – DCK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.