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SN74LVC1G11DCKREP PDF预览

SN74LVC1G11DCKREP

更新时间: 2024-11-02 06:12:59
品牌 Logo 应用领域
德州仪器 - TI 输入元件
页数 文件大小 规格书
11页 525K
描述
SINGLE 3-INPUT POSITIVE AND GATE

SN74LVC1G11DCKREP 技术参数

生命周期:Obsolete零件包装代码:SOIC
包装说明:TSSOP, TSSOP6,.08针数:6
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.22系列:LVC/LCX/Z
JESD-30 代码:R-PDSO-G6长度:2 mm
逻辑集成电路类型:AND GATE功能数量:1
输入次数:3端子数量:6
最高工作温度:125 °C最低工作温度:-55 °C
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP6,.08封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH传播延迟(tpd):17.2 ns
认证状态:Not Qualified座面最大高度:1.1 mm
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):1.65 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:MILITARY
端子形式:GULL WING端子节距:0.65 mm
端子位置:DUAL宽度:1.25 mm
Base Number Matches:1

SN74LVC1G11DCKREP 数据手册

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SN74LVC1G11-EP  
www.ti.com ...................................................................................................................................................................................................... SCES787JULY 2009  
SINGLE 3-INPUT POSITIVE AND GATE  
1
FEATURES  
2
Available in the Texas Instruments NanoFree™  
Package  
SUPPORTS DEFENSE, AEROSPACE,  
AND MEDICAL APPLICATIONS  
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Available in Military (–55°C/125°C)  
Temperature Range(1)  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.9 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
Ioff Supports Partial-Power-Down Mode  
Operation  
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
(1) Additional temperature ranges are available - contact factory  
DESCRIPTION/ORDERING INFORMATION  
Y + A B C or Y + A ) B ) C  
The SN74LVC1G11 performs the Boolean function  
in positive logic.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
–55°C to 125°C  
SOT (SC-70) – DCK  
Reel of 3000  
SN74LVC1G11DCKREP  
OBF  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  

SN74LVC1G11DCKREP 替代型号

型号 品牌 替代类型 描述 数据表
74LVC1G11GV NEXPERIA

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