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SN74LVC1G11MDCKREP PDF预览

SN74LVC1G11MDCKREP

更新时间： 2024-11-20 06:12:59
品牌 Logo 应用领域
德州仪器 - TI 栅极触发器逻辑集成电路光电二极管输入元件
页数 文件大小 规格书
11页 525K
描述
SINGLE 3-INPUT POSITIVE AND GATE

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SN74LVC1G11MDCKREP 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SC-70, 6 PIN针数：6
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：6 weeks
风险等级：1.69Is Samacsys：N
系列：LVC/LCX/ZJESD-30 代码：R-PDSO-G6
JESD-609代码：e4长度：2 mm
负载电容（CL）：50 pF逻辑集成电路类型：AND GATE
最大I（ol）：0.032 A湿度敏感等级：1
功能数量：1输入次数：3
端子数量：6最高工作温度：125 °C
最低工作温度：-55 °C封装主体材料：PLASTIC/EPOXY
封装代码：TSSOP封装等效代码：TSSOP6,.08
封装形状：RECTANGULAR封装形式：SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
包装方法：TR峰值回流温度（摄氏度）：260
电源：3.3 V最大电源电流（ICC）：0.01 mA
Prop。Delay @ Nom-Sup：5.9 ns传播延迟（tpd）：17.2 ns
认证状态：Not Qualified施密特触发器：NO
座面最大高度：1.1 mm子类别：Gates
最大供电电压 (Vsup)：5.5 V最小供电电压 (Vsup)：1.65 V
标称供电电压 (Vsup)：1.8 V表面贴装：YES
技术：CMOS温度等级：MILITARY
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：1.25 mm
Base Number Matches：1

SN74LVC1G11MDCKREP 数据手册

 浏览型号SN74LVC1G11MDCKREP的Datasheet PDF文件第2页浏览型号SN74LVC1G11MDCKREP的Datasheet PDF文件第3页浏览型号SN74LVC1G11MDCKREP的Datasheet PDF文件第4页浏览型号SN74LVC1G11MDCKREP的Datasheet PDF文件第5页浏览型号SN74LVC1G11MDCKREP的Datasheet PDF文件第6页浏览型号SN74LVC1G11MDCKREP的Datasheet PDF文件第7页 
SN74LVC1G11-EP  
www.ti.com ...................................................................................................................................................................................................... SCES787–JULY 2009  
SINGLE 3-INPUT POSITIVE AND GATE  
1
FEATURES  
2
•
Available in the Texas Instruments NanoFree™  
Package  
SUPPORTS DEFENSE, AEROSPACE,  
AND MEDICAL APPLICATIONS  
•
•
•
•
Controlled Baseline  
One Assembly/Test Site  
One Fabrication Site  
Available in Military (–55°C/125°C)  
Temperature Range(1)  
Extended Product Life Cycle  
Extended Product-Change Notification  
Product Traceability  
•
•
•
•
•
•
Supports 5-V VCC Operation  
Inputs Accept Voltages to 5.5 V  
Max tpd of 5.9 ns at 3.3 V  
Low Power Consumption, 10-µA Max ICC  
±24-mA Output Drive at 3.3 V  
•
•
•
Ioff Supports Partial-Power-Down Mode  
Operation  
•
•
Latch-Up Performance Exceeds 100 mA Per  
JESD 78, Class II  
ESD Protection Exceeds JESD 22  
–
–
–
2000-V Human-Body Model (A114-A)  
200-V Machine Model (A115-A)  
1000-V Charged-Device Model (C101)  
(1) Additional temperature ranges are available - contact factory  
DESCRIPTION/ORDERING INFORMATION  
Y + A • B • C or Y + A ) B ) C  
The SN74LVC1G11 performs the Boolean function  
in positive logic.  
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the  
package.  
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,  
preventing damaging current backflow through the device when it is powered down.  
ORDERING INFORMATION(1)  
TA  
PACKAGE(2)  
ORDERABLE PART NUMBER  
TOP-SIDE MARKING  
–55°C to 125°C  
SOT (SC-70) – DCK  
Reel of 3000  
SN74LVC1G11DCKREP  
OBF  
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI  
website at www.ti.com.  
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
NanoFree is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2009, Texas Instruments Incorporated  
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